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Application of crystalline silicon micro-powder

A crystalline silicon and micropowder technology, which is applied in manufacturing tools, printed circuit manufacturing, grinding/polishing equipment, etc., can solve the problems of unstable large abrasive particles and high metal foreign matter content, and achieve low metal foreign matter content, low electrical conductivity, High whiteness effect

Pending Publication Date: 2020-03-24
JIANGSU NOVORAY NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a new use of crystalline silicon micropowder as an abrasive for the problems of unstable large particles and high content of metal foreign matter in the prior art.

Method used

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  • Application of crystalline silicon micro-powder
  • Application of crystalline silicon micro-powder
  • Application of crystalline silicon micro-powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Example 1, the use of a crystalline silicon micropowder: the use is to use the crystalline silicon micropowder as an abrasive for roller brush grinding of printed circuit boards.

[0017] The mass percentage content of described crystalline silicon micropowder is: SiO 2 ≥99.0%, Al 2 o 3 2 o 3 ≤0.04%, CaO≤0.1%, MgO≤0.1%; water content≤0.1%; magnetic substance≤10.0ppm.

[0018] The particle size distribution of the crystalline silica powder is: D10=4.3±0.3 μm, D50=23.5±3.0 μm; D90=60.0±5.0 μm.

[0019] The whiteness of the crystalline silica powder is 50-95, the pH is 5.0-7.0, the specific gravity is 2.60, and the hardness is 6.5-7.0.

[0020] The electrical conductivity of the crystalline silica powder is 1-30µS / cm.

[0021] Prepared by conventional methods.

Embodiment 2

[0022] Example 2, the use of a crystalline silicon powder: the use is to use the crystalline silicon powder as an abrasive for roller brush grinding of printed circuit boards.

[0023] The mass percentage content of described crystalline silicon micropowder is: SiO 2 ≥99.0%, Al 2 o 3 2 o 3 ≤0.04%, CaO≤0.1%, MgO≤0.1%; water content≤0.1%; magnetic substance≤10.0ppm.

[0024] The particle size distribution of the crystalline silica powder is: D10=4.46 μm, D50=21.66 μm, D90=56.39 μm, D100=120.23 μm.

[0025] The whiteness of the crystalline silica powder is 50-95, the pH is 5.0-7.0, the specific gravity is 2.60, and the hardness is 6.5-7.0. The electrical conductivity of the crystalline silica powder is 1-30µS / cm.

Embodiment 3

[0026] Embodiment 3, using the crystalline silicon micropowder of the present invention and volcanic ash, corundum to make the comparative experiment of abrasive and its result:

[0027] 1. Chemical composition, see table 1 below:

[0028] Table I

[0029]

[0030] Crystalline silica powder metal oxide is much lower than volcanic ash.

[0031] 2. Physical and chemical properties, see Table 2 below:

[0032] Table II

[0033]

[0034] Compared with volcanic ash, crystalline silica powder has slightly larger specific gravity, lower electrical conductivity and higher whiteness.

[0035] 3. Metal foreign matter, see Table 3 below:

[0036] Table three

[0037]

[0038] The magnetic metal foreign matter of crystalline silica powder is obviously less than that of volcanic ash.

[0039] 4. Particle size distribution, see Table 4:

[0040] Table four

[0041]

[0042] 5. Comparison of use effect - the proportion of copper wire on the board surface, see Table 5:

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Abstract

The invention relates to an application of crystalline silicon micro-powder. The crystalline silicon micro-powder is used as an abrasive material for plate roller brush grinding of a printed circuit board. The crystalline silicon micro-powder comprises the following components in percentage by mass: more than or equal to 99.0% of SiO2, less than 1% of Al2O3, less than or equal to 0.04% of Fe2O3, less than or equal to 0.1% of CaO and less than or equal to 0.1% of MgO; the water content is less than or equal to 0.1%; and the content of magnetic substances is less than or equal to 10.0 ppm. The crystalline silicon micro-powder is used as an abrasive in the PCB industry, volcanic ash and corundum are replaced by the crystalline silicon micro-powder, the manufacturing method is high in controllability, stable in particle size distribution, low in metal foreign matter content, low in conductivity and high in whiteness, copper wires on the surface of the manufactured printed circuit board aregreatly reduced by using the crystalline silicon micro-powder as the abrasive, and the quality is better.

Description

technical field [0001] The invention relates to an abrasive, in particular to the use of crystalline silicon micropowder as an abrasive. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] In the PCB industry, when the surface of the board is etched with a film and the solder mask is brushed with oil, if the surface roughness of the board is not enough, the dry film will fall off and the oil will be lost in the later stage. Therefore, an abrasive is needed to cooperate with the roller brush to grind to increase the surface roughness of the board. In the prior art, volcanic ash is used as abrasive for roller brush grinding. Volcanic ash refers to gravel an...

Claims

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Application Information

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IPC IPC(8): H05K3/00B24B57/04
CPCH05K3/0044B24B57/04
Inventor 曹家凯李晓冬刘雪
Owner JIANGSU NOVORAY NEW MATERIAL CO LTD
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