Quality monitoring controller for bonding equipment and lumped control method thereof

Abstract

The invention relates to the technical field of wire welding machines and aims to provide a quality monitoring controller for bonding equipment and a lumped control method thereof. According to the technical scheme, the quality monitoring controller is characterized by comprising a third-party slave station module, a Z encoder interface, a USG ultrasonic interface, an EFO high-voltage ignition interface, a WCL wire clamp interface and an LED light source interface. The third-party slave station module is in two-way communication with an operation control planner, and the third-party slave station module comprises an FS force sensor interface used for obtaining real-time contact force information during welding of the bonding equipment; the Z encoder interface is used for acquiring positioninformation, speed information and acceleration information of the Z axis of the bonding equipment; the USG ultrasonic interface is used for acquiring ultrasonic state information and transmitting ultrasonic real-time planning information to the ultrasonic generator; the EFO high-voltage ignition interface is used for acquiring ignition state information and sending an ignition real-time instruction to the EFO controller; the WCL wire clamp interface is used for sending a wire clamp opening and closing real-time instruction to the wire clamp driving unit; and the LED light source interface isused for sending real-time instructions of the light source and the camera to the LED light source driving unit. The invention is suitable for quality monitoring and lumped control of bonding equipment.

Description

technical field [0001] The invention relates to the technical field of bonding equipment, more specifically, it relates to a quality monitoring controller for bonding equipment and a lumped control method thereof. Background technique [0002] Fully automatic bonding equipment integrates software control, motion control, image algorithm, and high-precision workbench for optical-mechanical-electrical integration automatic equipment. The equipment has built-in high-frequency vibration ultrasonic system and high-voltage ignition system, fast and sensitive wire clamping device, etc. etc., mainly used for wire bonding in the production of light-emitting diodes, SMD surface mount devices, high-power light-emitting diodes, LED digital tubes, semiconductor triodes and some special semiconductor sensors. [0003] When the bonding equipment is bonding, firstly, the capillary is brought into contact with the surface of the chip, then an appropriate pressure is applied, and finally the ...

AI Technical Summary

Problems solved by technology

However, there are inconsistencies in the height of the chip. Simply by improving the displacement control accuracy, there is no closed-loop control of the contact force, and it is difficult to meet the requirements of high-speed wire bonding.

[0006] At present, the domestic fully automatic bonding equipment is built with the general motion control card as the core, and the contact force is controlled in an open loop. There is a certain gap in the operation and control performance of the overall solution, and various processes that require real-time cooperation Modules usually use IO to interact with each other, and the interaction speed is slow, which aggravates the performance gap of the whole machine process system and cannot meet the precise and high-speed bonding requirements.

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