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Chip tantalum capacitor and its cathode manganese dioxide layer quality control method

A quality control method, manganese dioxide layer technology, applied in the direction of measuring electrical variables, instruments, measuring electricity, etc., can solve the problems of user quality pressure, economic loss, etc., to improve inherent reliability, promote process optimization, and improve product quality Effect

Active Publication Date: 2022-06-24
SHANGHAI PRECISION METROLOGY & TEST RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the current lack of quality control requirements for the cathode manganese dioxide layer of chip tantalum capacitors in the industry, the manufacturers and quality assurance agencies have not included this index in the scope of batch quality control, so that some batches of products are in the process of power-on. The inherent defects of local electrical stress concentration caused by quality problems such as holes and delamination in the manganese dioxide layer have not been discovered in advance, but are finally exposed after passing through layers of barriers until they are delivered for use, which has brought huge quality pressure and economical pressure to users. loss

Method used

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  • Chip tantalum capacitor and its cathode manganese dioxide layer quality control method
  • Chip tantalum capacitor and its cathode manganese dioxide layer quality control method
  • Chip tantalum capacitor and its cathode manganese dioxide layer quality control method

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Embodiment 1

[0033] figure 2 Shown is a flow chart of the quality control method for the cathode manganese dioxide layer of the chip tantalum capacitor according to the preferred embodiment of the present invention.

[0034] see figure 2 , the quality control method of the cathode manganese dioxide layer of the chip tantalum capacitor of this embodiment includes the following steps:

[0035] S11, Sample Preparation

[0036] According to the principle of 2% of the total number of production batches, no less than 5 and no more than 10, samples are obtained.

[0037] S12, visual inspection

[0038] The structure, marks and external surfaces of the samples are examined with a microscope (eg, a 20X magnification microscope). Defect criterion: The content of the sample identification should be clear and complete, the molding encapsulation material should be free of cracks and defects that expose the inner (tantalum core) core, and there should be no stress crack marks on the lead-out end (...

Embodiment 2

[0057] Figure 5 Shown is a flow chart of a quality control method for a chip tantalum capacitor according to a preferred embodiment of the present invention.

[0058] see Figure 5 , the quality control method of the chip tantalum capacitor in this embodiment includes the following steps:

[0059] S21, Sample Preparation

[0060] According to the principle of 2% of the total number of production batches, no less than 5 and no more than 10, samples are obtained.

[0061] S22, Visual inspection

[0062] The structure, marks and external surfaces of the samples are examined with a microscope (eg, a 20X magnification microscope). Defect criterion: The content of the sample identification should be clear and complete, the molding encapsulation material should be free of cracks and defects that expose the inner (tantalum core) core, and there should be no stress crack marks on the lead-out end (positive and negative lead-out ends), and the lead-out end should be coated The str...

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Abstract

The invention relates to a chip tantalum capacitor and a method for controlling the quality of the cathode manganese dioxide layer. Meet the following requirements: there is no local delamination or void in the cathode manganese dioxide layer whose size is larger than 1 / 4 of the short side of the tantalum core; for A shell or B shell size products, the inner size of the cathode manganese dioxide layer is smaller than 1 / 4 of the short side of the tantalum core 4. The number of local delaminations or voids greater than 1 / 6 of the short side of the tantalum core is less than 4, and not concentrated on one side; for C shell and above size products, the inner size of the cathode manganese dioxide layer is smaller than 1 / 4 of the short side of the tantalum core , The number of local delaminations or voids greater than 1 / 8 of the short side of the tantalum core <4, and not concentrated on one side. The invention increases the quality control requirements of the cathode manganese dioxide layer, avoids the use of chip tantalum capacitors similar to "inherent local electrical stress concentration" in products, and ensures the reliability of the products after installation.

Description

technical field [0001] The invention relates to the technical field of quality and reliability detection of chip tantalum capacitors, and relates to a chip tantalum capacitor and a quality control method for the cathode manganese dioxide layer thereof. Background technique [0002] Tantalum capacitors are products with small size and large capacitance among capacitors. They are widely used in the fields of aviation, aerospace and weapons. They are typically used in power circuits to achieve filtering, bypassing, decoupling, and energy storage. effect. Chip tantalum capacitors are the most widely used tantalum capacitors, including tantalum core 11, positive electrode 12, tantalum wire 13, negative electrode 14, manganese dioxide layer 15, graphite 16, silver paste 17, molding encapsulation material 18 and positive and negative electrodes. ,like figure 1 shown. [0003] Due to the unidirectional conductivity and rectification characteristics of the dielectric oxide film on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/95G01N1/28G01B21/00G01B21/20G01R31/12
CPCG01N21/95G01N1/286G01B21/00G01B21/20G01R31/1227G01N2001/2866
Inventor 李娟李春朱敏尉刘楠张辉孔泽斌张超罗宇华祝伟明江芸楼建设
Owner SHANGHAI PRECISION METROLOGY & TEST RES INST
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