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A kind of low-temperature lead-free solder paste and preparation method thereof

A technology of lead-free solder paste and low-temperature solder, applied in welding equipment, manufacturing tools, welding media, etc., can solve the problems of low solder joint toughness, high cost, and difficult to disperse, and achieve poor reinforcement effect and improve strength and toughness , Improve the effect of dispersion

Active Publication Date: 2021-12-07
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the large amount of bismuth metal contained in this solder paste, the toughness of the solder joints is low, and the electronic devices cannot meet the performance requirements.
Carbon nanotubes are developing into an excellent reinforcing phase for traditional solder paste due to their good mechanical, electrical and thermal properties. The compatibility of carbon nanotubes is poor, and the reinforcing effect of carbon nanotubes in solder paste cannot be exerted
In the current research, the surface metallization treatment of carbon nanotubes is mostly carried out to enhance the compatibility with tin alloys. Although this method can achieve the effect of strengthening and toughening carbon nanotubes, the process is relatively complicated, the cost is high, and the product quality is high. Unstable, in the existing research, there is no research on adding carbon nanotubes in the form of pure substances, but achieving the effect of strengthening and toughening solder paste

Method used

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  • A kind of low-temperature lead-free solder paste and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0047] The present embodiment provides a low-temperature lead-free solder paste, a weight percentage of raw materials low temperature solder comprising 85%, 15% help paste; low-temperature solder as a reference, the low temperature solder alloy powder comprises 99.63wt% Sn42Bi58 and 0.37wt% of carbon nanotubes, wherein the carbon nanotubes are multi-walled carbon nanotubes short carboxy, later in the abundance of carbon graphene Suzhou Ltd., product designation HQNANO-CNTs-007-1C (outer diameter of 8 ~ 15 nm, length of 0.5 to 2 microns); reference to help solder paste according to parts by weight, the co paste comprising 35 parts of rosin, 30 parts of solvent, 8 parts of active agents, thickeners 7 parts, 12 parts of the additive wherein the rosin is a polymerized rosin and hydrogenated rosin, the weight ratio of the two is 4: 1, the solvent is diethylene glycol hexyl ether, the active agent is adipic acid and hexadecylamine hydrofluoride, in a weight ratio of 20: 1, the additive ...

Embodiment 2

[0049] The present embodiment provides a low-temperature lead-free solder paste, a weight percentage of raw materials low temperature solder comprising 85%, 15% help paste; low-temperature solder as a reference, the low temperature solder alloy powder comprises 99.63wt% Sn42Bi58 and 0.37wt% of carbon nanotubes, wherein the carbon nanotubes are multiwall carbon nanotubes short hydroxylated, later in the abundance of carbon graphene Suzhou Ltd., product designation HQNANO-CNTs-007-1H (outer diameter of 8 ~ 15 nm, length of 0.5 to 2 microns); reference to help solder paste according to parts by weight, the co paste comprising 35 parts of rosin, 30 parts of solvent, 8 parts of active agents, thickeners 7 parts, 12 parts of the additive wherein the rosin is a polymerized rosin and hydrogenated rosin, the weight ratio of the two is 4: 1, the solvent is diethylene glycol hexyl ether, the active agent is adipic acid and hexadecylamine hydrofluoride, in a weight ratio of 20: 1, the additiv...

Embodiment 3

[0051] The present embodiment provides a low-temperature lead-free solder paste, a weight percentage of raw materials low temperature solder comprising 85%, 15% help paste; low-temperature solder as a reference, the low temperature solder alloy powder comprises 99.63wt% Sn42Bi58 and 0.37wt% of carbon nanotubes, wherein the carbon nanotubes are multi-wall carbon nanotubes short, later in the abundance of carbon the Suzhou graphene Ltd., product designation HQNANO-CNTs-007-1 (outer diameter of 8 to 15 nanometers , length of 0.5 to 2 microns); reference to help solder paste according to parts by weight, the co paste comprising 35 parts of rosin, 30 parts of solvent, 8 parts of active agents, thickeners 7 parts, 12 parts of an additive, wherein rosin and polymerized rosin hydrogenated rosin, in a weight ratio of 4: 1, the solvent is diethylene glycol hexyl ether, the active agent is adipic acid and hexadecylamine hydrofluoride, in a weight ratio of 20: 1, the additive is dodecanedioic...

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Abstract

The invention relates to the technical field of electronic welding, in particular to a low-temperature lead-free solder paste and a preparation method thereof. A low-temperature lead-free solder paste, according to weight percentage, its raw materials include 84-87% of low-temperature solder and 13-16% of solder paste, wherein the low-temperature solder includes tin-bismuth series alloys and carbon nanotubes, and the solder paste Including rosin, solvent, activator, thickener, additive, the present invention improves the performance of carbon nanotubes in solder paste by adding multi-walled carbon nanotubes with a specific aspect ratio, and supplemented by adding specific activators and thickeners. The dispersibility in the medium enhances the compatibility with other components, thereby solving the problem of insufficient solder joint strength and toughness of conventional tin-bismuth solder.

Description

Technical field [0001] The present invention relates to the technical field of electronic welding, particularly relates to a preparation method and a low temperature lead-free solder. Background technique [0002] As electronic information products to ultra-large-scale integration, miniaturization of solder paste has become the surface mount technology (SMT) is the most important process material. SAC solder paste using a conventional general series alloys (SnAgCu alloy series) as the welding material, the welding temperature is higher than 240 deg.] C is generally required, easy to produce deformation during welding device highly integrated micro-electronic devices, so the current multi- employed to tin-bismuth alloy series of low temperature solder paste. [0003] However, since this kind of paste contains a large amount of bismuth metal components, resulting in a lower weld toughness, resulting in an electronic device can not meet the performance requirements. And because the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/26B23K35/14
CPCB23K35/025B23K35/262B23K35/3613
Inventor 陈钦宫梦奇梁少杰陈旭徐华侨张阳张义宾翁若伟
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU