Thermally driven programmable elastic active transfer stamp for non-contact transfer

Abstract

The invention discloses a non-contact transfer printing method of a heat-driven programmable elastic active transfer stamp. The stamp is composed of a high polymer prepared with a cavity array, a heat-driven working fluid and a microstructure film. The transfer method is as follows: 1) When picking up, keep a small gap between the bottom surface of the stamp and the device. Under the action of an external temperature field, the heat-driven working medium in the stamp cavity is heated to expand or undergo a phase change, causing the elastic film to bulge. The elastic film is pressed on the micro-nano electronic components, and the device is successfully picked up; 2) When printing, keep a large gap between the bottom surface of the stamp / device and the substrate. Under the external temperature field, the elastic film bulges, and the seal / device interface The adhesion weakened sharply, the device was ejected and separated from the stamp, and the device was successfully printed. The transfer printing method of the invention has good versatility and can print devices on any substrate; the printing response time is fast, the throughput per unit time is large, and large-scale selective and patterned parallel transfer printing can be realized.

Description

technical field [0001] The invention relates to a transfer printing technology, in particular to a thermally driven programmable transfer stamp and a non-contact transfer printing method, which can be used for the deterministic assembly of arbitrarily patterned micro-nano electronic components. Electronics, MicroLED display and other fields have very important application prospects. Background technique [0002] Transfer printing is an emerging material assembly technique that uses soft polymer stamps to transfer micro and nanoelectronic components from one substrate (donor substrate) to another (acceptor substrate). This technology can process thousands of components in one second, and can integrate different types of discrete components independently prepared on a large scale to form a spatially ordered functional system. For example, flexible and stretchable inorganic electronic products that integrate hard and brittle semiconductor materials on soft elastomers, MicroLED...

AI Technical Summary

Problems solved by technology

[0005] At the same time, due to the need to contact the stamp with the host substrate, the nature and geometry of the host substrate will greatly limit the application range of contact transfer printing technology, while non-contact transfer printing eliminates the above limitations.

[0006] Usually, the most widely used non-contact transfer printing technology is the laser-driven thermal mismatch transfer printing technology. However, a higher temperature (about 300°C) is usually required to produce a thermal mismatch that can be used for printing, and it is easy to damage the surface of the stamp. and thermal damage to the device, which limits its application

[0007] In our previous research, we designed a programmable active transfer stamp based on bionic design (CN201810732161.8), which achieved selective printing, but could not achieve selective pickup. However, industrial applications have practical implications for this. Requirements, such as selectively picking up LED chips of specific wavelengths from the LED growth substrate, selectively removing display dead pixels on the display panel, etc.

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