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A kind of nanocomposite porous polyimide film and preparation method thereof

A polyimide film and polyimide technology are applied in the field of nanocomposite porous polyimide film and its preparation, and achieve the effects of mild conditions, simple technology and improved mechanical properties

Active Publication Date: 2022-05-24
INST OF CHEM ENG GUANGDONG ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the existing problems in the preparation of low dielectric constant polyimide films in the prior art, one of the purposes of the present invention is to provide a nanocomposite porous polyimide film, and two of the purposes of the present invention are to provide such Preparation method of nanocomposite porous polyimide film

Method used

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  • A kind of nanocomposite porous polyimide film and preparation method thereof
  • A kind of nanocomposite porous polyimide film and preparation method thereof
  • A kind of nanocomposite porous polyimide film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0046] The preparation method of the porous polyimide film of the present example comprises the following steps:

[0047] 1) Weigh 3 g of nano-silica with an average particle size of 50 nm to 500 nm and add it to a 500 mL three-necked flask, add 300 mL of toluene and 4 g of propyltriethoxysilane, and stir and reflux for 1 day at 110°C under nitrogen protection. Then centrifugal washing and drying to obtain modified nano-silica.

[0048] 2) 5 mg of polyimide and 0.1 mg of didodecyldimethylammonium bromide (DDAB) were dissolved in 20 mL of dichloromethane to prepare a polyimide organic solution.

[0049] 3) Add 0.05 mg of modified nano-silica particles to the polyimide organic solution, and ultrasonically disperse the nanoparticles evenly for 30 min. Then add 1 mL of deionized water to mix, and emulsify with an emulsifying machine to obtain a stable Pickering emulsion.

[0050] 4) Coat the emulsion on a clean glass substrate and freeze-dry it at -30°C for 20h to obtain a porou...

Embodiment 2～5

[0052] The preparation process of Examples 2 to 5 is the same as that of Example 1, and the obtained porous polyimide films are all about 100 μm. The only difference between the examples is that the emulsion components are different. The emulsion components of Examples 1 to 5 are shown in Table 1.

[0053] Table 1 Emulsion composition of each embodiment

[0054]

Embodiment 4

[0057] The scanning electron microscope image of the polyimide film prepared in Example 4 is attached figure 1 shown. from figure 1 It can be confirmed that the polyimide film has a porous structure.

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Abstract

The invention discloses a nanocomposite porous polyimide film and a preparation method thereof. This porous polyimide film is prepared by the following preparation method: 1) reacting nanoparticles with a silane coupling agent to obtain modified nanoparticles; 2) dissolving polyimide and auxiliary additives in an organic solvent 3) Mix and disperse the polyimide solution and modified nanoparticles, then add water to mix and emulsify to obtain a Pickering emulsion; 4) Coat the emulsion on the substrate and dry it to obtain . The preparation method of the invention has the characteristics of mild conditions, low cost, simple and convenient operation process and technology. Due to the selection of water droplets and modified nanoparticles, it is not only cheap but also does not require additional steps to remove. Pores can be introduced into the polyimide film to reduce the dielectric constant. At the same time, the addition of nanoparticles can also improve the mechanical properties of the film. It is expected Used in electronics, microelectronics, aerospace and other industries.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a nano-composite porous polyimide film and a preparation method thereof. Background technique [0002] Polyimide (PI) has oxidation resistance, heat resistance, radiation resistance, low temperature characteristics and It has many advantages such as drug resistance and is widely used in the electrical and electronic industry. However, as microelectronic devices continue to advance to nanoscale technology nodes, interconnect layer dielectric materials are required to have a dielectric constant less than 2.0 to reduce interconnect delay and dielectric losses. The traditional PI dielectric constant is between 2.9 and 3.4, which is difficult to meet the requirements of the future microelectronics industry. For this reason, low dielectric constant polyimide films and their preparation are of great significance. [0003] According to Clausius-Mosotti equation, there are tw...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08J9/28C08L79/08C08K9/06C08K3/36
CPCC08J5/18C08J9/28C08J9/009C08J2379/08C08J2201/0484
Inventor 王全勇周军伟李伟浩麦裕良
Owner INST OF CHEM ENG GUANGDONG ACAD OF SCI