Epoxy adhesive fast curable at room temperature and preparation method thereof

An epoxy adhesive, fast curing technology, applied in the direction of adhesive, epoxy resin, adhesive type, etc., can solve the problems of restricting production efficiency, slow strength improvement, short operation time, etc., to achieve rapid strength improvement capability, Appropriate operating time, enhanced mechanical properties

Inactive Publication Date: 2020-05-01
BEIJING COMENS NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, acrylic adhesives have the following disadvantages: ①It has a strong odor during use, which has a certain impact on users and the environment; ②The operating time is short, the curing speed is fast, and the reaction exotherm is violent, so it cannot be used for bonding large areas and large gaps; ③It is not ideal in terms of high temperature resistance, corrosion resistance and weather resistance
However, the existing epoxy adhesives have the following disadvantages: ① The strength of epoxy adhesives with a long operating time is slow to increase. The operating time of such adhesives is mostly 1-2 hours, and generally takes 10-15 hours to be initially cured, which seriously restricts production efficiency and increases process cost
② Epoxy adhesives with short initial curing time, short operating time and poor toughness
The operation time of this kind of epoxy adhesive is 5-15 minutes, the initial curing time is 2-3 hours, the speed of strength improvement is still slow, and the adaptability to large-size and special-shaped substrates is poor, and most of these epoxy adhesives have poor toughness
③The adhesion of epoxy adhesive to some demolded composite materials needs to be improved

Method used

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  • Epoxy adhesive fast curable at room temperature and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment approach

[0033] (1) The epoxy resin is at least one of bisphenol A type epoxy resin and bisphenol F type epoxy resin. The bisphenol A type epoxy resin adopts at least one of epoxy resin E-44, epoxy resin E-51, and epoxy resin E-54. The bisphenol F epoxy resin is at least one of epoxy resin F-51 and epoxy resin F-44.

[0034] (2) The flexible epoxy resin is at least one of flexible epoxy resin NPER-174, flexible epoxy resin YD-171, flexible epoxy resin NPER-133L, and flexible epoxy resin GY 298.

[0035](3) The toughening agent in component A adopts at least one of Qishi toughening agent and core-shell toughening agent; the toughening agent in component B adopts amino-terminated nitrile rubber and Qishi toughening agent at least one of the The Qishi toughening agent is at least one of Qishi toughening agent VL-4 and Qishi toughening agent VL-1; the core-shell toughening agent is formed by uniformly dispersing core-shell rubber in epoxy resin of blends. The core-shell rubber is a pol...

Embodiment 1

[0054] A kind of room temperature rapid curing epoxy adhesive, its preparation method comprises the following steps (each raw material is by weight):

[0055] Preparation of component A: Add 80 parts of epoxy resin E-51, 20 parts of flexible epoxy resin NPER-174, 50 parts of core-shell toughening agent, and 4 parts of coupling agent sj-42 into the reactor at room temperature Stirring, the planetary speed is 15-20Hz, the dispersion speed is 650rpm, vacuum is required during the stirring process, and the pressure is kept between -0.095--0.1MPa; after stirring for 30min, the dispersion speed is reduced to 250rpm, and 30 parts of calcium carbonate, 20 parts of barium sulfate whiskers, 4 parts of hydrophobic fumed silica, and then increase the dispersion speed to 650rpm, vacuumize, and keep the pressure between -0.095~-0.1MPa; stir for 2h, and clean the kettle every 30min during the period. Ensure the uniform dispersion of calcium carbonate, barium sulfate whiskers and hydrophobic ...

Embodiment 2

[0059] A kind of room temperature rapid curing epoxy adhesive, its preparation method comprises the following steps (each raw material is by weight):

[0060] Preparation of component A: 45 parts of epoxy resin E-44, 30 parts of epoxy resin F-51, 25 parts of flexible epoxy resin YD-171, 40 parts of core-shell toughening agent, 10 parts of Qishi toughening agent Add VL-4, 4 parts of coupling agent A172 into the reaction kettle and stir at room temperature. The planetary speed is 15-20Hz, and the dispersion speed is 650rpm. Vacuum is required during the stirring process, and the pressure is kept between -0.095~-0.1MPa. ; After stirring for 30 minutes, reduce the dispersion speed to 250 rpm, add 30 parts of alumina, 20 parts of barium sulfate whiskers, and 4 parts of hydrophobic fumed silica, then increase the dispersion speed to 650 rpm, vacuumize, and keep the pressure at -0.095 Between ~-0.1MPa; Stir for 2 hours, clear the kettle every 30 minutes during this period, to ensure ...

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Abstract

The invention discloses an epoxy adhesive fast curable at room temperature and a preparation method thereof. The adhesive is composed of a component A and a component B, wherein the component A and the component B are cooperatively used according to a volume ratio of 100: (40-60). The component A comprises 60 to 80 parts of epoxy resin, 20 to 40 parts of flexible epoxy resin, 40 to 60 parts of a flexibilizer, 4 to 6 parts of a coupling agent, 40 to 60 parts of a filler and 4 to 6 parts of hydrophobic fumed silica. The component B comprises 20-40 parts of a modified polyamide curing agent, 20-30 parts of a modified aliphatic amine curing agent, 15-25 parts of a modified alicyclic amine curing agent, 3-10 parts of a toughening accelerator, 5-10 parts of a toughening agent, 20-30 parts of a filler, 2-3 parts of hydrophobic fumed silica and 2-3 parts of a coupling agent. The adhesive has the advantages of appropriate operation time, fast strength improvement capability, high toughness, good mechanical strength, and excellent adhesion to metals and composite materials.

Description

technical field [0001] The invention relates to the field of epoxy adhesives, in particular to a room-temperature fast-curing epoxy adhesive for toughened high-strength composite materials and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, the application of various new plastics and high-strength composite materials (SMC, GRP, CFRP) in aerospace, automobile industry, machinery manufacturing, medical field, rail vehicles, smart home and other fields is gradually increasing. , in the application process of these materials will involve a large number of bonding between metal and composite materials, composite materials and composite materials. However, composite materials need to add some release agents during the molding process, which makes it difficult to have a good bonding effect. After continuous research and development, acrylic adhesives and epoxy adhesives are currently used more in the field of compos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08C08G59/46C08G59/56C08G59/68
CPCC08G59/46C08G59/56C08G59/686C08K2003/265C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08L51/04C08L15/00C08K13/04C08K7/08C08K3/36C08K3/26C08K5/544
Inventor 吴浩罗善国
Owner BEIJING COMENS NEW MATERIALS
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