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Resin composition, prepreg and laminated board

A technology of resin composition and prepreg, which is applied in the field of prepreg, laminate and resin composition, to achieve the effects of improving production efficiency, saving process cost, and good mechanical and thermal properties

Pending Publication Date: 2020-05-12
杭州爵豪科技有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The liquid epoxy resin composition disclosed by CN106589823A can be fully cured in 15 minutes at 120°C, but can only be stored for one week under refrigeration (4°C)

Method used

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  • Resin composition, prepreg and laminated board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Step 1: Add 3.5 parts of dicyandiamide, 0.9 parts of dimethylimidazole, and 1.8 parts of N-acyl imidazole into 60 parts of N,N-dimethylformamide and acetone organic solvent, and add 100 parts of bisphenol after the dissolution is complete A epoxy resin is prepared as an epoxy resin composition.

[0027] Step 2: Evenly coat the epoxy resin composition on the electronic grade glass fiber cloth and bake at 120--180°C for 2-5 minutes, then cool to room temperature to make a prepreg;

[0028] Step 3: Stack the prepreg 1 to multi-layer prepreg, attach the release film on both sides, stack the stainless steel plate up and down, send it into the stacked hot press machine, 140-160℃ / 0.5-5MPa high temperature and high pressure molding for 15-30min , made of thermosetting laminates ①.

[0029] Step 4: Store the prepreg at room temperature for 1 month, and perform hot-press molding according to the process of step 3 to make a thermosetting laminate②.

[0030] Observe the molding o...

Embodiment 2

[0032] Step 1: Add 10.3 parts of diaminodiphenyl sulfone, 1.9 parts of 2-ethyl-4 methylimidazole, 1.3 parts of tetramethylethylenediamine to 60 parts of N,N-dimethylformamide and acetone organic solvent After dissolving completely, add 100 parts of bisphenol A epoxy resin to prepare epoxy resin composition.

[0033] Preparation and testing were carried out according to the process steps of Example 1.

Embodiment 3

[0035] Step 1: Add 39.5 parts of linear phenol formaldehyde resin, 1.4 parts of 2-undecylimidazole (C11Z) imidazole, 2.3 parts of 1,2-dimethylimidazole to 80 parts of N,N-dimethylformamide and propylene glycol formaldehyde In the ether organic solvent, add 100 parts of bisphenol A epoxy resin and mix evenly after dissolving completely, and add 20 parts of silicon dioxide, 10 parts of titanium dioxide, 5 parts of talc powder, 0.8 parts of silane coupling agent, and 0.5 parts of fatty acid dispersant part, fully stirred to prepare an epoxy resin composition.

[0036] Preparation and testing were carried out according to the step process of Example 1.

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Abstract

The invention discloses a resin composition, a prepreg and a laminated board. The resin composition provided by the invention comprises epoxy resin, a first curing agent, a second curing agent and a third curing agent, wherein the first curing agent is a latent curing agent; the second curing agent is an imidazole curing agent; and the third curing agent is a tertiary amine curing agent. The prepreg prepared from the resin composition provided by the invention has the advantages of medium-and-high-temperature rapid curing, long normal-temperature storage time and the like. The laminated boarddisclosed by the invention is good in mechanical properties and thermal properties; meanwhile, the production efficiency of the whole process is improved; and the process cost is saved.

Description

technical field [0001] The invention belongs to the technical field of polymer resin compositions, and in particular relates to a resin composition, a prepreg and a laminated board. Background technique [0002] Epoxy resin has the characteristics of high mechanical properties, excellent bonding performance, small curing shrinkage, excellent process performance and good stability. It is one of the thermosetting plastics mainly used in the field of composite materials. The process of preparing high-strength composite materials by impregnating glass fiber cloth with epoxy resin glue generally includes resin composition preparation, coating glue and drying to make prepregs, and prepregs are stacked and hot-pressed. Therefore, it is required that the prepared prepreg has moderate processing temperature, fast curing rate, good storage stability at room temperature, and is suitable for processing and molding technology. [0003] However, epoxy resin composition / prepreg products c...

Claims

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Application Information

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IPC IPC(8): C08G59/40C08G59/56C08G59/50C08L63/00C08K7/14B32B17/02B32B17/12B32B33/00B32B15/18B32B15/04B32B37/06B32B37/10
CPCC08G59/4021C08G59/56C08G59/504C08G59/5073C08G59/5006C08K7/14B32B5/02B32B5/26B32B33/00B32B15/18B32B15/04B32B37/06B32B37/10B32B2262/101B32B2255/02B32B2255/26B32B2307/546B32B2307/30
Inventor 洪机剑陈华刚沈泉锦何小玲陈文泉傅楚娴
Owner 杭州爵豪科技有限公司
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