Etching solution, additive and manufacturing method for metal layout wires

Abstract

The invention discloses an etching solution, an additive and a manufacturing method for metal layout wires. The etching solution is prepared from the following main components in percentage by weight:5-30% of hydrogen peroxide, 0.1-5% of a hydrogen peroxide stabilizer, 5-25% of a chelating agent, 0.1-1% of a surfactant, 0.1-5% of an inorganic acid oxidant, and the balance of deionized water, wherein the additive is added into the etching solution while the etching solution is repeatedly used. The etching solution is free of fluorides, is environmentally friendly, and has the advantages of being moderate in etching rate, proper in etching angle, small in line width loss, free of metal residues, and the like. The additive and the etching solution are combined for use, so that the service life of the etching solution can be greatly prolonged.

Description

Technical field [0001] This application relates to the technical field of etching solutions, and in particular to a manufacturing method of etching solutions, additives and metal wiring. Background technique [0002] Etching is a technique in which materials are removed using chemical reaction or physical impact; etching techniques are divided into wet etching and dry etching. Among them, wet etching uses chemical reagents to achieve the purpose of etching through chemical reactions. The effect of etching can directly affect the accuracy and quality of the high-density thin wire image. [0003] Conventional liquid crystal display devices (LCD, Liquid Crystal Display) used aluminum or aluminum alloy for metal wiring. However, with the increase in size and resolution of liquid crystal display devices, aluminum or aluminum alloy materials have high electrical resistivity. Prone to signal delay and other issues, thereby affecting the display effect. The copper material can meet the ...

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Problems solved by technology

[0004] The existing hydrogen peroxide-based copper / molybdenum film etchant often contains fluoride in order to increase the etching rate, and fluoride is not friendly to the environment; in addition, the existence of fluoride is not conducive to the health of operators; and its corrosion ability is strong , tends to cause corrosion of the substrate glass; in addition, there is a large amount of fluoride in the wastewater in the etching production line, which also poses a threat to the environment, which greatly increases the treatment cost of the waste liquid

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