A kind of high-precision etching solution for ito conductive film and preparation method thereof
A conductive film and etching solution technology, applied in chemical instruments and methods, surface etching compositions, etc., can solve the problems of increasing process difficulty, difficult to control etching accuracy, and high etching solution cost, and can meet the technical process and process requirements, Etching accuracy without residue, the effect of excellent etching performance
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Embodiment 1
[0032] For the high-precision etching solution of ITO conductive film, this etching solution component is composed as follows by weight percentage: the nitric acid of 5wt%, the sulfuric acid of 8wt%, the potassium pyrophosphate of 0.1wt%, the ethylene thiourea of 0.1wt%, remaining The amount is water.
[0033] Its preparation method comprises the following steps:
[0034] (1) Add electronic grade sulfuric acid in the mixing tank in proportion;
[0035] (2) Under the condition of constant stirring, add electronic grade nitric acid in proportion, and circulate for 30min;
[0036] (3) Under the condition of constant stirring, add the two kinds of additives and the remaining water in proportion, and circulate for 5 hours;
[0037] (4) Filter the mixed liquid with a 0.1 μm filter to obtain an ITO etching solution.
[0038] The thickness of this etchant etching object ITO layer is The etching time is 300s, and the etching temperature is 40°C.
Embodiment 2
[0040] Be used for the high precision etchant of ITO conductive thin film, this etchant component is composed as follows by weight percentage: the nitric acid of 2wt%, the sulfuric acid of 12wt%, the potassium acetate of 0.1wt%, the N-methylthiourea of 0.1wt% , and the balance is water.
[0041] Its preparation method comprises the following steps:
[0042] (1) Add electronic grade sulfuric acid in the mixing tank in proportion;
[0043] (2) Under the condition of constant stirring, add electronic grade nitric acid in proportion, and circulate for 30min;
[0044] (3) Under the condition of constant stirring, add the two kinds of additives and the remaining water in proportion, and circulate for 5 hours;
[0045] (4) Filter the mixed liquid with a 0.1 μm filter to obtain an ITO etching solution. The thickness of this etchant etching object ITO layer is The etching time is 135s, and the etching temperature is 45°C.
Embodiment 3
[0047] For the high-precision etching solution of ITO conductive film, the components of the etching solution are composed as follows by weight percentage: 4wt% nitric acid, 12wt% sulfuric acid, 0.01wt% potassium dihydrogen phosphate, 1.99wt% imidazole, the balance for water.
[0048] Its preparation method comprises the following steps:
[0049] (1) Add electronic grade sulfuric acid in the mixing tank in proportion;
[0050] (2) Under the condition of constant stirring, add electronic grade nitric acid in proportion, and circulate for 30min;
[0051] (3) Under the condition of constant stirring, add the two kinds of additives and the remaining water in proportion, and circulate for 5 hours;
[0052] (4) Filter the mixed liquid with a 0.1 μm filter to obtain an ITO etching solution. The thickness of this etchant etching object ITO layer is The etching time is 360s, and the etching temperature is 35°C.
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