A kind of high-precision etching solution for ito conductive film and preparation method thereof

A conductive film and etching solution technology, applied in chemical instruments and methods, surface etching compositions, etc., can solve the problems of increasing process difficulty, difficult to control etching accuracy, and high etching solution cost, and can meet the technical process and process requirements, Etching accuracy without residue, the effect of excellent etching performance

Active Publication Date: 2018-09-28
HANGZHOU GREENDA CHEM
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, CN201510832036.0 discloses an ITO etchant for high-generation flat panels, which uses sulfuric acid / nitric acid / acetic acid as the main system, and the acid content used is relatively high, the etching reaction is violent, and it is difficult to control the etching accuracy, so it is not applicable Due to the small thickness of the ITO film layer, and the cost of the etching solution is high. In addition, the etching solution contains acetic acid. During use, the acetic acid is easy to volatilize and needs to be replenished continuously, which increases the difficulty of the process.
CN200910003907.2 discloses an etchant composition for etching an indium tin oxide layer and an etching method using the same. The etchant composition is mainly composed of sulfuric acid, nitric acid, and an etching control agent, and the etching control agent is mainly potassium Salt, the acid concentration of the etching solution is low, the etching rate is slow, and it is easy to corrode the underlying Mo and Al, which is difficult to meet the process and process requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of high-precision etching solution for ito conductive film and preparation method thereof
  • A kind of high-precision etching solution for ito conductive film and preparation method thereof
  • A kind of high-precision etching solution for ito conductive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] For the high-precision etching solution of ITO conductive film, this etching solution component is composed as follows by weight percentage: the nitric acid of 5wt%, the sulfuric acid of 8wt%, the potassium pyrophosphate of 0.1wt%, the ethylene thiourea of ​​0.1wt%, remaining The amount is water.

[0033] Its preparation method comprises the following steps:

[0034] (1) Add electronic grade sulfuric acid in the mixing tank in proportion;

[0035] (2) Under the condition of constant stirring, add electronic grade nitric acid in proportion, and circulate for 30min;

[0036] (3) Under the condition of constant stirring, add the two kinds of additives and the remaining water in proportion, and circulate for 5 hours;

[0037] (4) Filter the mixed liquid with a 0.1 μm filter to obtain an ITO etching solution.

[0038] The thickness of this etchant etching object ITO layer is The etching time is 300s, and the etching temperature is 40°C.

Embodiment 2

[0040] Be used for the high precision etchant of ITO conductive thin film, this etchant component is composed as follows by weight percentage: the nitric acid of 2wt%, the sulfuric acid of 12wt%, the potassium acetate of 0.1wt%, the N-methylthiourea of ​​0.1wt% , and the balance is water.

[0041] Its preparation method comprises the following steps:

[0042] (1) Add electronic grade sulfuric acid in the mixing tank in proportion;

[0043] (2) Under the condition of constant stirring, add electronic grade nitric acid in proportion, and circulate for 30min;

[0044] (3) Under the condition of constant stirring, add the two kinds of additives and the remaining water in proportion, and circulate for 5 hours;

[0045] (4) Filter the mixed liquid with a 0.1 μm filter to obtain an ITO etching solution. The thickness of this etchant etching object ITO layer is The etching time is 135s, and the etching temperature is 45°C.

Embodiment 3

[0047] For the high-precision etching solution of ITO conductive film, the components of the etching solution are composed as follows by weight percentage: 4wt% nitric acid, 12wt% sulfuric acid, 0.01wt% potassium dihydrogen phosphate, 1.99wt% imidazole, the balance for water.

[0048] Its preparation method comprises the following steps:

[0049] (1) Add electronic grade sulfuric acid in the mixing tank in proportion;

[0050] (2) Under the condition of constant stirring, add electronic grade nitric acid in proportion, and circulate for 30min;

[0051] (3) Under the condition of constant stirring, add the two kinds of additives and the remaining water in proportion, and circulate for 5 hours;

[0052] (4) Filter the mixed liquid with a 0.1 μm filter to obtain an ITO etching solution. The thickness of this etchant etching object ITO layer is The etching time is 360s, and the etching temperature is 35°C.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a high-precision etching solution for an ITO (Indium Tin Oxide) conductive film and a preparation method for the high-precision etching solution. The high-precision etching solution is prepared from the following ingredients in percentage by weight: 2% to 8% of nitric acid, 2% to 12% of sulfuric acid, 0.01% to 2% of additive and the balance of water, wherein the additive is a mixture of an alkali metal salt and an organic matter, and the organic matter is any selected from a thiourea derivative, hexamethylene tetramine, imidazole, benzotriazole and 2,4,6-trihydroxybenzoic acid. According to the etching solution disclosed by the invention, nitric acid and sulfuric acid serve as main ingredients, the process is simple, the acid concentration is moderate, the etching solution has excellent etching performance on the ITO conductive film, the etching rate is moderate, the etching precision is high, no residue is caused, and thus the requirements of ITO of different thicknesses on etching can be met. Meanwhile, one alkali metal salt and one organic matter are adopted as the additive, so that the etching solution has an excellent etch-resistant effect on lower-layer metal Al or Mo, and the requirements of technical processes and preparation procedures can be excellently met. In addition, the etching solution takes the low-cost sulfuric acid as a raw material, so that the reduction of the cost of the etching solution is facilitated on the basis of meeting the requirements of the technical processes and the preparation procedures.

Description

technical field [0001] The invention relates to the field of wet electronic chemicals, in particular to a high-precision etching solution for ITO conductive thin films and a preparation method thereof. Background technique [0002] Transparent conductive oxides are becoming more and more commercially important, and the most widely used and valuable areas are in the flat panel display manufacturing industry. Currently, the transparent conductive oxide used as an electrode is mainly Indium-tin-oxide (ITO). ITO etchant is widely used in the manufacturing process of ITO transparent electrodes in TFT-LCD industry. The etching of the ITO film is the last process in the manufacture of the TFT pattern Array. After the ITO film is sputtered, a layer of photoresist is covered, the photomask develops the pattern, and the ITO film is etched with an etching solution, and then the photoresist is stripped to form the desired pattern. In addition, with the development of the display indu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C09K13/06
CPCC09K13/06
Inventor 胡涛刘志彪陈虹飞邢攸美尹云舰
Owner HANGZHOU GREENDA CHEM
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products