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Thermally reduced graphene supported by nano-α-alumina, preparation method and high thermal conductivity and electrical insulation elastomer thermal interface material

A technology of alumina loading and thermal interface materials, which is applied in the field of heat-reduced graphene and high thermal conductivity electrical insulation elastomer thermal interface materials, can solve the problems of equipment short circuit, danger, unfavorable circuit packaging, etc., and achieve good shielding effect and guarantee Effect of improving electrical insulation properties and thermal conductivity

Active Publication Date: 2021-02-19
BEIJING UNIV OF CHEM TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of material has ultra-high electrical conductivity at the same time, so that the thermal interface material has electrical conductivity; this is extremely unfavorable to circuit packaging, and the thermal interface material directly covered on the chip is very easy to short-circuit the device and cause danger.

Method used

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  • Thermally reduced graphene supported by nano-α-alumina, preparation method and high thermal conductivity and electrical insulation elastomer thermal interface material
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  • Thermally reduced graphene supported by nano-α-alumina, preparation method and high thermal conductivity and electrical insulation elastomer thermal interface material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The formula consists of the following raw materials in parts by weight: silicone gel A component / silica gel B component (100 parts in total), 3 parts of thermally reduced graphene supported by nano-α-alumina, 200 parts of micron alumina, platinum catalyst 0.02 parts, silicone oil plasticizer 2 parts.

[0033] The specific experimental process is: mix 300ml of graphene oxide aqueous slurry (concentration: 3.3‰) with 100ml of nano-γ-alumina aqueous dispersion (concentration: 5%), then ultrasonically stir electrostatic self-assembly for 3 hours, and then centrifuge and freeze-dry to obtain nano-oxidized Graphene oxide powder supported on aluminum; the powder is heated to 1500° C. for 2 hours under the protection of nitrogen to obtain thermally reduced graphene supported by nano-α-alumina. Put all the raw materials in the formula in a planetary mixer, stir and mix at 40 rpm for 10 minutes, put the mixture in a certain-shaped tetrafluoro mold at 80°C for 15 minutes to obtain...

Embodiment 2

[0035] The formula consists of the following raw materials in parts by weight: silicone gel A component / silica gel B component (100 parts in total), 3 parts of thermally reduced graphene supported by nano-α-alumina, 800 parts of micron alumina, platinum catalyst 0.02 parts, silicone oil plasticizer 2 parts.

[0036] The specific experimental process is: mix 300ml of graphene oxide aqueous slurry (concentration: 3.3‰) with 100ml of nano-γ-alumina aqueous dispersion (concentration: 5%), then ultrasonically stir electrostatic self-assembly for 3 hours, and then centrifuge and freeze-dry to obtain nano-oxidized Graphene oxide powder supported on aluminum; the powder is heated to 1500° C. for 2 hours under the protection of nitrogen to obtain thermally reduced graphene supported by nano-α-alumina. Put all the raw materials in the formula in a planetary mixer, stir and mix at 40 rpm for 10 minutes, put the mixture in a certain-shaped tetrafluoro mold at 80°C for 15 minutes to obtain...

Embodiment 3

[0038] The formula consists of the following raw materials in parts by weight: silicone gel A component / silicone gel B component (100 parts in total), 3 parts of thermally reduced graphene supported by nano-α-alumina, 200 parts of micron aluminum nitride, platinum 0.02 parts of catalyst, 2 parts of silicone oil plasticizer.

[0039]The specific experimental process is: mix 300ml of graphene oxide aqueous slurry (concentration: 3.3‰) with 100ml of nanometer γ-alumina aqueous dispersion (concentration: 5%), then ultrasonically stir electrostatic self-assembly for 3 hours, and then centrifuge and freeze-dry to obtain nano oxide Graphene oxide powder supported on aluminum; the powder was heated to 1500° C. for 2 hours under the protection of nitrogen to obtain thermally reduced graphene supported by nano-α-alumina. Put all the raw materials in the formula in a planetary mixer, stir and mix at 40 rpm for 10 minutes, put the mixture in a certain-shaped tetrafluoro mold at 80°C for 1...

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Abstract

The invention provides a thermally reduced graphene supported by nano-α-alumina, a preparation method, and a thermal interface material of a high thermal conductivity electrical insulation elastomer. Mix the graphene oxide slurry with the nano-γ-alumina dispersion, ultrasonically stir the electrostatic self-assembly for 0.5-5 hours, and then centrifuge and freeze-dry to obtain the graphene oxide powder supported by nano-alumina; heat the obtained powder to 600 °C under the protection of nitrogen ~2000°C and keep it for 0.5~2h to obtain the thermally reduced graphene supported by nano-α-alumina. The obtained reduced hybrid filler and micron filler are compounded and filled into silicone rubber, and the obtained thermal interface material has high volume resistivity and thermal conductivity, and can meet the performance requirements of integrated circuit package heat dissipation. In addition, the method of the present invention has the advantages of simple and convenient processing technology, does not involve the use of toxic solvents, can be matched with actual factory processing equipment, and can be directly used for production.

Description

technical field [0001] The invention relates to the field of thermal interface materials for integrated circuit packaging, in particular to a thermally reduced graphene supported by nano-α-alumina, a preparation method, and a thermal interface material of high thermal conductivity and electrical insulation elastomers. Background technique [0002] With the continuous development of the electronics industry towards high power loss, integration and miniaturization, the energy density of modern electronic equipment has increased significantly, which makes it generate a lot of heat during use. If the heat cannot be exported in time, the local excessive The temperature will cause the device to freeze, or even destroy the circuit (we call it thermal failure). Thermal management is a series of means to solve this problem. Thermal interface material is a very critical material in thermal management. Its main function is to fill the micro-gap and holes with different surface bumps w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K9/12C08K3/04C08K3/22C08L83/04
CPCC08K3/22C08K9/12C08K2003/2227C08K2201/011C08L2203/206C08K3/042C08L83/04
Inventor 卢咏来李京超李守俊冯予星孙树泉赵秀英张立群
Owner BEIJING UNIV OF CHEM TECH
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