A kind of cyanide-free silver-based composite plating solution and silver-based composite coating and preparation method thereof
A silver-based composite and plating solution technology, applied in the field of metal surface treatment, to achieve good stability, increase Zeta potential, and reduce interference
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Embodiment 1
[0046]This embodiment provides a cyanide-free silver-based composite plating solution and a silver-based composite plating layer formed on the surface of 20mm×30mm×1mm red copper by using the cyanide-free silver-based composite plating solution.
[0047]The cyanide-free silver-based composite plating solution includes silver nitrate, multiple complexing agents, conductive salts, buffers, cationic surfactants, additives and micro-nano particles.
[0048]The multi-element complexing agent uses triethylenetetramine as the main complexing agent, and triethylenetetraamine hexaacetate sodium and sodium citrate as auxiliary complexing agents.
[0049]The concentration of the silver nitrate is 0.3mol / L, the concentration ratio of the main complexing agent to silver nitrate is 3:1, and the concentration of the auxiliary complexing agent is 0.05mol / L (sodium triethylenetetraamine hexaacetate and sodium citrate) Equimolar concentration), the concentration of the conductive salt is 0.5mol / L, and the buf...
Embodiment 2
[0056]This embodiment provides a cyanide-free silver-based composite plating solution and a silver plating layer formed by using the cyanide-free silver-based composite plating solution on a surface of 20 mm×30 mm×1 mm red copper.
[0057]The cyanide-free silver-based composite plating solution includes silver nitrate, multiple complexing agents, conductive salts, buffers, cationic surfactants, additives and micro-nano particles.
[0058]The multi-element complexing agent uses triethylenetetramine as the main complexing agent, and triethylenetetraamine hexaacetate sodium and sodium citrate as auxiliary complexing agents.
[0059]The concentration of the silver nitrate is 0.3mol / L, the concentration ratio of the main complexing agent to silver nitrate is 3:1, and the concentration of the auxiliary complexing agent is 0.05mol / L (sodium triethylenetetraamine hexaacetate and sodium citrate) Equimolar concentration), the concentration of the conductive salt is 0.5mol / L, and the buffer is used to ...
Embodiment 3
[0066]This embodiment provides a cyanide-free silver-based composite plating solution and a silver-based composite plating layer formed on the surface of 20mm×30mm×1mm red copper by using the cyanide-free silver-based composite plating solution.
[0067]The cyanide-free silver-based composite plating solution includes silver nitrate, multiple complexing agents, conductive salts, buffers, cationic surfactants, additives and micro-nano particles.
[0068]The multi-element complexing agent uses triethylenetetramine as the main complexing agent, and triethylenetetraaminehexaacetic acid, ethylenediaminetetraacetic acid and citric acid as auxiliary complexing agents.
[0069]The concentration of the silver nitrate is 0.3mol / L, the concentration ratio of the main complexing agent to the silver nitrate is 3:1, and the concentration of the auxiliary complexing agent is 0.06mol / L (the three auxiliary complexing agents are equimolar concentrations) , The concentration of the conductive salt is 0.8mol / L...
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