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Lead-free solder, preparation method and application thereof and metal terminal

A lead-free solder and metal terminal technology, used in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of high melting point, high internal stress, and high welding temperature, and achieve a simple and reliable manufacturing process. The effect of high, low melting temperature

Inactive Publication Date: 2020-06-09
南通欢腾机电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The related technologies of the automobile industry are highly developed, and the convenience and comfort of operation are getting higher and higher. At the same time, people are paying more and more attention to physical health and environmental safety. Therefore, the use of lead-containing auto parts is further restricted.
[0003] At present, various lead-free solders have been widely used, but due to the lack of lead in the lead-free solder alloy, the mechanical strength and the stability of solder joint quality have decreased to varying degrees.
At the same time, due to the high welding temperature of lead-free solder alloys for general automotive glass, there is a problem that the glass is prone to micro-cracks or cracks when applied to automotive glass.
For example, the current common lead-free solders are mainly Sn-Ag-Cu series and Sn-Ag series alloys. When they are used for welding electrical components on automotive glass, the glass is prone to quality defects such as microcracks or cracks. The main reason is that the This type of lead-free solder has a higher melting point. When the electrical component base material (such as copper) is soldered to the conductive metal layer of automotive glass (such as silver paste layer), this type of lead-free solder will generate high internal stress.

Method used

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  • Lead-free solder, preparation method and application thereof and metal terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] This embodiment provides a kind of lead-free solder, it comprises the following steps:

[0025] (1) Weigh 65.9g of indium, 29.65g of tin, 0.11g of silver, 0.01g of copper, 2g of bismuth, 2g of zinc, and 0.33g of antimony, and set aside.

[0026] (2) After heating tin to a molten state, stop heating, and simultaneously add copper, silver, indium, antimony, and bismuth and stir for 18 minutes to obtain mixture A.

[0027] (3) After the mixture A was heated to 700°C, the heating was stopped, and zinc was added and stirred until the zinc melted to obtain the mixture B.

[0028] (4) After the mixture B was heated to 250° C. and kept for 5 minutes, casting and molding treatment was performed to obtain the lead-free solder.

Embodiment 2

[0030] This embodiment provides a kind of lead-free solder, it comprises the following steps:

[0031] (1) Weigh 74.9g of indium, 25.05g of tin, 0.01g of silver, 0.01g of copper, 0.01g of bismuth, 0.01g of zinc, and 0.01g of antimony, and set aside.

[0032] (2) After tin was heated to a molten state, the heating was stopped, and copper, silver, indium, antimony, and bismuth were added simultaneously and stirred for 28 minutes to obtain mixture A.

[0033] (3) After the mixture A was heated to 800°C, the heating was stopped, and zinc was added and stirred until the zinc melted to obtain the mixture B.

[0034] (4) After heating the mixture B to 350° C. and keeping it for 5 minutes, casting and molding treatment is performed to obtain the lead-free solder.

Embodiment 3

[0036] This embodiment provides a kind of lead-free solder, it comprises the following steps:

[0037] (1) Weigh 65.9g of indium, 25.05g of tin, 4.94g of silver, 0.1g of copper, 0.01g of bismuth, 2g of zinc, and 2g of antimony, and set aside.

[0038] (2) After tin is heated to a molten state, the heating is stopped, and copper, silver, indium, antimony, and bismuth are added simultaneously and stirred for 25 minutes to obtain a mixture A.

[0039] (3) After the mixture A was heated to 750°C, the heating was stopped, and zinc was added and stirred until the zinc melted to obtain the mixture B.

[0040] (4) After heating the mixture B to 300° C. and keeping it for 5 minutes, casting and molding treatment is performed to obtain the lead-free solder.

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Abstract

The invention is suitable for the technical field of welding, and provides a lead-free solder, a preparation method and application thereof, and a metal terminal. The lead-free solder comprises the following components of, in percentage by mass, 65.9%-74.9% of indium, 25.05%-29.65% of tin, 0.01%-4.95% of silver, 0.01%-1% of copper, 0.01%-2% of bismuth, 0.01%-2% of zinc and 0.01%-2% of antimony, wherein the sum of the mass fractions of all the components is 100%. The lead-free solder is low in melting temperature, simple in manufacturing process and high in reliability, is suitable for weldingof automobile glass and electrical connecting pieces and low-temperature welding of electronic components, and can well ameliorate the phenomenon of microcracks or cracks of automobile glass during orafter welding of the electrical components.

Description

technical field [0001] The invention belongs to the field of soldering technology, and in particular relates to a lead-free solder, its preparation method, its application and a metal terminal. Background technique [0002] The related technologies of the automobile industry are highly developed, and the convenience and comfort of operation are getting higher and higher. At the same time, people are paying more and more attention to their health and environmental safety. Therefore, the use of lead-containing auto parts is further restricted. [0003] At present, various lead-free solders have been widely used, but due to the lack of lead in the lead-free solder alloy, the mechanical strength and the stability of solder joint quality are reduced to varying degrees. At the same time, due to the high welding temperature of lead-free solder alloys used in general automotive glass, there is a problem that the glass is prone to micro-cracks or cracks when applied to automotive gla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40H01R43/02H01R43/16
CPCB23K35/26B23K35/40H01R43/0235H01R43/16
Inventor 周萍
Owner 南通欢腾机电科技有限公司
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