A kind of preparation technology of epoxy resin mastic mold
An epoxy resin cement and epoxy resin technology, which is applied in the field of mold forming, can solve the problems of not filling the gaps, process rhythm breaking, mold matrix resin cracks, etc., so as to improve the efficiency and the use efficiency of equipment, and save curing time. , Reduce the effect of mold deformation
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Embodiment 1
[0033] Embodiment 1: the preparation technology of a kind of epoxy resin mastic mold of the present invention, comprises the steps:
[0034] (1) Make the mold cavity according to the product graphic data;
[0035] (2) the mold cavity inner wall is provided with an adhesive paper that can be released; the mold cavity of this example can be made with benzene board foam;
[0036] (3) Lay cured epoxy resin bricks in the mold cavity, fill epoxy resin cement between adjacent epoxy resin bricks, and fill the gap between the epoxy resin bricks and the inner wall of the mold cavity with epoxy resin. Resin cement, so that multiple epoxy resin bricks are connected into a whole through epoxy resin cement; when laying, according to the size of the mold cavity, select the appropriate brick size; near the mold surface, use small size bricks , it is convenient to use epoxy resin cement to find the shape; the length, width and height of the bricks described in this example are: 200-400mm, 100...
Embodiment 2
[0053] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the material components of the epoxy resin bricks and epoxy resin mastic described in this embodiment are the same. In parts by mass: epoxy resin: 100 parts; curing agent: 60 parts; filler: 550 parts; toughening agent: 10 parts. The curing molding is to stand at 25°C for 30 minutes. The toughening agent is phthalate. The filler is aluminum hydroxide. In this example, the curing agent is selected from diaminodicyclohexylmethane, methylcyclopentanediamine, bisaminomethylcyclohexyldiamine or low-molecular polyamide.
Embodiment 3
[0054] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the material components of the epoxy resin bricks and epoxy resin mastic described in this embodiment are the same. In parts by mass: epoxy resin: 100 parts; curing agent: 50 parts; filler: 400 parts; toughening agent: 4 parts. The curing molding is to stand at 30° C. for 90 minutes. The toughening agent is polyimide, nano calcium carbonate or nano titanium dioxide. The filler is a graphite filler material. The curing agent in this example is T31 curing agent.
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