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Preparation method of mixed-material glue-free composite material based on high-frequency waves

A composite material, high-frequency technology, applied in the direction of manufacturing tools, wood processing appliances, wood veneer bonding, etc., can solve the problems of high defect rate, open glue, endanger human health and other problems, achieve high toughness, high strength, formaldehyde and The effect of low xylene content

Active Publication Date: 2020-06-30
广平凯王压密科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, the research and application of composite materials have received high attention. It has a variety of excellent properties, does not require secondary processing, and is easy to install. However, the existing composite materials mostly use organic materials that contain formaldehyde, xylene, etc. that are harmful to the human body. , endanger human health, and cannot meet people's needs. At the same time, composite materials made of various wood boards still have problems such as glue opening, and the defect rate is high, which increases production costs.

Method used

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  • Preparation method of mixed-material glue-free composite material based on high-frequency waves
  • Preparation method of mixed-material glue-free composite material based on high-frequency waves
  • Preparation method of mixed-material glue-free composite material based on high-frequency waves

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Experimental program
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Effect test

Embodiment 1-8

[0046] Embodiment 1-8 provides 8 kinds of preparation methods based on high-frequency mixed materials and glue-free composite materials, and these 8 kinds of composite materials are composed of at least two pieces with a density of no more than 0.7kg / m 3 The planks are formed by high-frequency heating and pressing, and a degenerated connection layer is formed between adjacent planks. The preparation method includes the following steps:

[0047] a. Pretreatment: Treat the plank to a moisture content of 8%-18% and a thickness of no more than 10cm to obtain a pretreated plank;

[0048] b. Lamination treatment: Take 2 or more pretreated wood boards and place them in layers according to at least one direction of force to make laminated wood boards. The direction of force includes the direction of direct pressure and the direction of indirect pressure;

[0049] c. Heating and pressure treatment: heat the degraded connection layer of laminated wood boards until the temperature of the...

Embodiment 9-11

[0069] Embodiment 9-11 is based on each parameter in the method for embodiment 5, difference is:

[0070] The number of planks is 5, and the thickness of each plank is the same, and is 8cm. The curing treatment in step d is heated by high-frequency waves. For N parts, measure the average moisture content Q of each part, assume that the temperature of the board when high-frequency heating is used in the curing process is T, and the heating time is t, then Q, T and t meet the following conditions:

[0071] When 8%≤Q≤10%, then 180℃≤T≤185℃, 1min≤t<2min;

[0072] When 10%

[0073] When 12%

[0074] When 14%

[0075] In the stacking process of step b: 5 pretreated wood boards are stacked according to the direction of indirect force to form a laminated wood board, and the densities of the adjacent first pretreated wood board and the second pretreated wood board are res...

Embodiment 12

[0083] This embodiment provides a preparation method based on high-frequency mixed materials and glue-free composite materials, which specifically includes the following steps:

[0084] The board has a density of 0.55kg / m 3 , the thickness of the glass plate is 1.5cm, and the composite material is mainly prepared by the following steps:

[0085] a. Pretreatment: Treat the plank to a moisture content of 10% and a thickness of 8 cm to obtain a pretreated plank;

[0086] b. Lamination treatment: Take 2 pre-treated wooden boards and place them in layers according to the direction of force, and place the glass plate between the two wooden boards to obtain a laminated wooden board;

[0087] c. Heating and pressure treatment: heat the degraded connection layer of the laminated wood boards to a temperature of 90° C., keep the heat for 5 minutes, and then perform pressure treatment according to the preset compression ratio (preset compression ratio P=35%);

[0088] d. Curing treatmen...

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Abstract

The invention relates to a preparation method of a mixed-material glue-free composite material based on high-frequency waves. The method is characterized in that at least two wood boards with densities not exceeding 0.7 kg / m3 are heated and pressed through the high-frequency waves, so that a degraded connection layer is formed between the two adjacent wood boards. The preparation method specifically comprises the following steps of pretreatment, laminating treatment, heating and pressurizing treatment, curing treatment, cooling treatment and health preservation treatment. The novel composite material prepared by the method has the characteristics of high strength, high toughness and low content of formaldehyde and xylene, and also has waterproof and anti-cracking performances.

Description

technical field [0001] The invention belongs to the technical field of wood board processing, and in particular relates to a preparation method of a high-frequency mixed material and glue-free composite material. Background technique [0002] In recent years, the research and application of composite materials have received high attention. It has a variety of excellent properties, does not require secondary processing, and is easy to install. However, the existing composite materials mostly use organic materials that contain formaldehyde, xylene, etc. that are harmful to the human body. , endanger human health, and cannot meet people's needs. At the same time, composite materials made of various wood boards also have problems such as degluing, and the defect rate is high, which increases production costs. Contents of the invention [0003] In order to solve the above-mentioned technical problems, the present invention provides a preparation method based on high-frequency m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27M3/00B27D1/00
CPCB27D1/00B27M3/0013B27M3/0066
Inventor 王凯
Owner 广平凯王压密科技有限公司
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