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144 results about "Gel free" patented technology

Polymer nano-composites as dry sensor material for biosignal sensing

A multifunctional polymer nano-composite sensor system for detecting various biosignals like ECG and other kinds of signals for sensing strain, temperature and moisture has been disclosed. This sensor system includes (1) a polymer nano-composite sensor material that is flexible, elastic, soft, and conductive, (2) a sensor material fabricated into a desired shape or form, and (3) a signal capturing interface for collecting, transmitting and processing the signals. This sensor system can easily be integrated into a user environment for various user-transparent sensing applications. The present invention more specifically reveals a multi-functional nano-composite sensor for detecting biologically generated electrical signals which is comprised of a polymeric composition having an electrically conductive wire embedded therein, wherein the polymeric composition has a dispersion phase and a dispersed phase, wherein the dispersion phase is comprised of a thermoplastic polymer or a thermoset polymer, wherein the dispersed phase includes an electrically conductive filler, wherein the polymeric composition is gel-free, and wherein the electrically conductive wire is adapted for conveying an electrical signal to a signal processing device. The present invention further discloses a polymeric composition which is comprised of a thermoplastic polyurethane, a styrenic polymer, and at least one electrically conductive filler wherein the styrenic polymer is present in the composition at a level which is within the range of 10 weight percent to 50 weight percent and wherein the electrically conductive filler is present at a level which is within the range of 0.5 weight percent to 40 weight percent, based on the total weight of the polymeric composition.
Owner:CLEVELAND MEDICAL POLYMERS

Non-adhesive polyethylene protective film and preparation method thereof

The invention discloses a non-adhesive polyethylene protective film and a preparation method thereof. The non-adhesive polyethylene protective film comprises a base film layer, an intermediate layer and a self-adhesive layer, wherein the base film layer comprises the following components in percentage by weight: 25 percent to 60 percent of low-density polyethylene, 40 percent of 75 percent of linear low-density polyethylene and 1 percent to 10 percent of metallocene linear low-density polyethylene. The intermediate layer comprises the following components in percentage by weight: 30 percent to 60 percent of low-density polyethylene, 40 percent to 70 percent of linear low-density polyethylene and 10 percent to 30 percent of ethylene-vinylacetate copolymer. The self-adhesive layer comprises the following components in percentage by weight: 5 percent to 15 percent of low-density polyethylene, 5 percent to 20 percent of linear low-density polyethylene and 80 percent to 90 percent of polyacrylate hot-melt pressure sensitive adhesive master batch. The non-adhesive polyethylene protective film has the advantages of high viscous force, no adhesive residue, good mechanical property, high transparency and the like. The defects of the existing polyethylene film can be overcome.
Owner:无锡达美新材料有限公司

Epoxidation method of gel-free double bond-contained polymer

InactiveCN101538338AHigh epoxy valueLow extraction residueSolubilityPolymer dissolution
The invention discloses an epoxidation method of a gel-free double bond-contained polymer, which relates to an epoxidation method of polymers, in particular to an epoxidation method of a gel-free double bond-contained polymer, which can avoid gel generation in the epoxidation reaction, improve the solubility property of epoxidation products and solve the difficult problem in commercial process of epoxidation products of double bond-contained polymers. The invention provides an improved epoxidation method of a gel-free double bond-contained polymer, which comprises the steps: the polymer is dissolved in an organic solvent to prepare a polymer solution which is then added with quaternary ammonium salt and formic acid to prepare a solution A by stirring; the solution A is added with hydrogen peroxide, then heat-preserved for reaction for at least one hour, and then heated for reaction to obtain reaction products; and after washing, an organic layer is separated and the solvent is removed by pressure reduction, thus obtaining the epoxidised gel-free double bond-contained polymer. By adding one quaternary ammonium salt or the compound of a plurality of quaternary ammonium salts, the method avoids the gelation phenomenon in the epoxidation reaction, thus leading the epoxidation reaction to be smoothly conducted and leading the epoxidation products to have good solubility property.
Owner:XIAMEN UNIV

Environment-friendly glue free particle board and preparation method thereof

The invention discloses an environment-friendly glue free particle board and a preparation method thereof, and belongs to artificial boards prepared by using natural-occurring substances. The environment-friendly glue free particle board is prepared by comprising the following steps: adding water with cane sugar, citric acid and acetic acid to prepare uniform compound additive, weighting the particles, uniformly spraying the compound additive on the surfaces of the particles, then paving the particles uniformly sprayed with the compound additive into a slab, prepressing, and then sending the pre-pressed slab into a thermocompressor to be hot pressed and formed. The raw material used in the invention is pure natural substance non-toxic to the safety of the human body; the integrated physical and mechanical properties of the board made by the compound additive recipe used in the invention is best; the acetic acid used in the invention has functions of bacteriostasis and mildew proofing; through the addition of certain acetic acid, the physical and mechanical properties of the board can be improved; meanwhile the durability can be improved. The physical and mechanical properties of the particle board are good; no free formaldehyde is released; the particle board can be taken as furniture, indoor decorating, packing and the like to use; the preparation method is simple and convenient; the common particle board production line is not needed to be changed to produce.
Owner:CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY

Flexible circuit board and manufacturing method thereof

The invention relates to a flexible circuit board, which comprises a plurality of copper clad substrates, a line pattern, a plurality of bonding colloids corresponding to the plurality of copper clad substrates, and a plurality of conductive holes; each copper clad substrate is provided with an insulating base material and an outer-layer line; the line pattern comprises a linear signal line, two ground lines and two hollow areas; the two ground lines are arranged at two sides of the linear signal line and are parallel to each other; the plurality of copper clad substrates are located at two reverse sides of the line pattern; each bonding colloid is stacked between the line pattern and the corresponding copper clad substrate; a gel-free slot is formed in each bonding colloid; the slots of the plurality of bonding colloids and the two hollow areas form an air dielectric layer to coat the linear signal line; the slot of each bonding colloid is aligned at the linear signal line; and the linear signal line is spaced from the plurality of bonding colloids to form a suspended state. The plurality of conductive holes are electrically connected with the plurality of outer-layer lines and the two ground lines. The invention further relates to a manufacturing method of the flexible circuit board.
Owner:AVARY HLDG (SHENZHEN) CO LTD +2

Bonding and potting method for aerial integrated motor

InactiveCN102306989AOvercoming the deficiency of roundness deviationManufacturing dynamo-electric machinesAdhesiveEngineering
The invention relates to a bonding and potting technology method for an aerial integrated motor, wherein the method covers a bonding method, preparation of a potting material for an elastic film, a potting die and a potting method. According to the invention, an elastic film is employed as a carrier and a characteristic of shape expansion by squeezing is utilized, so that an end commutator is isolated from an adhesive and a potting material and it can be ensured that there is no superfluity at the surface of the commutator after the bonding and potting processing; meanwhile, an axiality after the potting processing can also be ensured. Besides, the elastic film comprises the following components according to mass percentage: 100% of GN 521 raw material; 100% of a GN 521 vulcanizing agent; and 10% to 50% of a filler. According to the invention, bonding and potting production and processing problems of an aerial integrated motor are solved and a purpose that a circularity of a commutator meets a requirement after the bonding and potting processing of the aerial integrated motor can be achieved; meanwhile, an effect that the surface of the commutator on the winding is free of gel after the bonding and potting processing is realized; and a defect of a circularity deviation of an inserted motor can be overcome.
Owner:FLIGHT AUTOMATIC CONTROL RES INST

Glue-free reconstituted veneer and preparing method thereof

Belongs to the technical field of wood processing. In order to solve the problem that an adhesive agent is adopted in an existing reconstituted veneer, and consequently, poisonous and harmful volatile matter is released, the preparing method of the glue-free reconstituted veneer comprises the steps that a fast-growing wood veneer is subjected to delignification by using a delignification solution to obtain a delignified wood sample; 80% of water in the delignified wood sample is removed through cold pressing; and after hot-pressing drying, a glue-free reconstituted veneer is obtained. According to the preparing method, hydroxyl on the surface of cellulose and hemicellulose is exposed through delignification, a multiple hydrogen-bond network is formed under pressure, and high mechanical strength and high size stability of the reconstituted veneer are given. In the preparing method, no adhesive agent is used, the reconstituted veneer is low in cost, simple in process and short in time, zero volatile of formaldehyde is really realized; the problems are solved that a great amount of the adhesive agent is used in artificial timbers, the indoor environment is polluted, and the human body health is harmed; and the glue-free reconstituted veneer has a higher market value.
Owner:NORTHEAST FORESTRY UNIVERSITY

Camera process protecting film

The invention discloses a camera process protecting film which sequentially comprises a first protecting layer, a PET supporting layer and a sticking layer from the top to the bottom, wherein the sticking layer is used for the connection between a product and a camera, a silica gel protecting film layer is used for avoiding unfavorable conditions such as adhesive residue and the like, due to the design of a local protecting film, the lens of the camera cannot be polluted by gel, and the design of a gel-free pulling ear part facilitates that an operator is free from influences caused by the viscosity of the silica gel protecting film layer during the use, therefore, assembling capacity is improved. The PET supporting layer plays a support heightening effect through a middle hollowing out method, so as to prevent the camera from the effect of external force which can cause crushed product and loss. The first protecting layer uses a full page PC polycarbonate material to seal the entire protecting film, so that the camera is isolated from the outside and dust pollution is avoided, moreover, harms to the product, caused by external force, can be avoided. The three layers are combined together, and a user can attach the tree-layered structure in one step, therefore, the requirement of high performance is met, the working hour for production is reduced, the cost is lowered, and the benefit is maximized.
Owner:苏州佳值电子工业有限公司
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