Polyimide resin and application thereof, two-layer adhesiveless base material and preparation method of two-layer adhesiveless base material

Abstract

The invention discloses polyimide resin, a preparation method and an application thereof, a two-layer adhesiveless base material and a preparation method of the two-layer adhesiveless base material. The polyimide resin comprises nano-silica which is modified by polyimide resin and a silane coupling agent dispersed in the polyimide resin, wherein polyimide resin is an intercondensation polymer of aromatic dianhydride and aromatic diamine; and the polyimide resin polymer is taken as a resin insulating layer by the two-layer adhesiveless base material. Compared with the prior art, the polyimide resin composition disclosed by the invention is capable of significantly improving the performance of the two-layer adhesiveless base material, so that the insulation resistance of the surface of a copper foil is enhanced; and meanwhile, the adhesive strength, the ion migration resistance, high-temperature and high-humidity oxidation resistance and corrosion resistance of the copper foil and the polyimide insulating layer are enhanced.

Description

technical field [0001] The invention relates to a flexible packaging circuit substrate, in particular to a polyimide resin composition and its use and preparation method, a two-layer adhesive-free base material and its preparation method. Background technique [0002] With the rapid development of the electronic industry, higher requirements are put forward for electronic equipment and electronic products. Light, thin, short, small, beautiful and excellent comprehensive performance have become the first choice of manufacturers and consumers. In order to meet this demand, the flexible printed circuit board (FPC) industry has successively developed two-layer adhesive-free substrates with thinner thickness and better performance. Compared with the three-layer adhesive substrate, the two-layer non-adhesive substrate is directly compounded by polyimide (PI) insulating resin layer and copper foil, without an intermediate adhesive layer, so it can be thinner and more durable. High...

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Problems solved by technology

[0010] In general, the above research work is to improve the performance of the two-layer adhesive-free substrate from the aspects of monomer synthesis and composition structure of the two-layer adhesive-free substrate. Although all have achieved certain results, the comprehensive performance still cannot meet the requirements. , cannot meet the needs of high-end products with high storage capacity and high-speed information transmission, and the process is complicated, the cost is high, and it is difficult to industrialize