Polyimide resin and application thereof, two-layer adhesiveless base material and preparation method of two-layer adhesiveless base material

A technology of polyimide resin and polyimide, which is applied in the field of two-layer adhesive-free substrate and its preparation, polyimide resin composition and its use and preparation, and can solve the problems that cannot meet the requirements of high storage capacity and high speed. For high-end products that transmit information, the comprehensive performance cannot meet the requirements, and the process is complex, etc., to achieve the effect of increasing adhesion, low cost, and simple process

Active Publication Date: 2015-06-03
GUANGDONG DANBOND TECH
View PDF12 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In general, the above research work is to improve the performance of the two-layer adhesive-free substrate from the aspects of monomer synthesis and composition structure of the two-layer adhesive-free substrate. Although all have achieved certain results, t

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Weigh 20g of nano-silica and add it to 95% ethanol solution, add 4g of γ-aminopropyltriethoxysilane (KH-550) silane coupling agent after ultrasonic dispersion, stir and react at 70°C for 5 hours, centrifuge Separation, washing, and drying to obtain silane coupling agent-modified nano-silica, the dried silane-coupling agent-modified nano-silica is dispersed in 3000g N,N-dimethylacetamide (DMAc) solvent , sonicate at room temperature for 2 hours to make it uniformly dispersed to become a silane coupling agent-modified nano-silica dispersion. Under the protection of nitrogen flow, weigh 120g of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), 40g of 4,4'-diaminodiphenyl ether and 30g of p-phenylenediamine Add in the nano-silica dispersion in turn, stir, and slowly add 70g of pyromellitic dianhydride (PMDA), 86g of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride (OPDA) to it after fully dissolving. ), 90g of 3,3',4,4'-benzophenonetetra-acid dianhydride (BTDA), reacted...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses polyimide resin, a preparation method and an application thereof, a two-layer adhesiveless base material and a preparation method of the two-layer adhesiveless base material. The polyimide resin comprises nano-silica which is modified by polyimide resin and a silane coupling agent dispersed in the polyimide resin, wherein polyimide resin is an intercondensation polymer of aromatic dianhydride and aromatic diamine; and the polyimide resin polymer is taken as a resin insulating layer by the two-layer adhesiveless base material. Compared with the prior art, the polyimide resin composition disclosed by the invention is capable of significantly improving the performance of the two-layer adhesiveless base material, so that the insulation resistance of the surface of a copper foil is enhanced; and meanwhile, the adhesive strength, the ion migration resistance, high-temperature and high-humidity oxidation resistance and corrosion resistance of the copper foil and the polyimide insulating layer are enhanced.

Description

technical field [0001] The invention relates to a flexible packaging circuit substrate, in particular to a polyimide resin composition and its use and preparation method, a two-layer adhesive-free base material and its preparation method. Background technique [0002] With the rapid development of the electronic industry, higher requirements are put forward for electronic equipment and electronic products. Light, thin, short, small, beautiful and excellent comprehensive performance have become the first choice of manufacturers and consumers. In order to meet this demand, the flexible printed circuit board (FPC) industry has successively developed two-layer adhesive-free substrates with thinner thickness and better performance. Compared with the three-layer adhesive substrate, the two-layer non-adhesive substrate is directly compounded by polyimide (PI) insulating resin layer and copper foil, without an intermediate adhesive layer, so it can be thinner and more durable. High...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08G73/10C08K9/06C08K3/36B32B15/08H05K1/03
Inventor 张双庆
Owner GUANGDONG DANBOND TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap