Ultra-low flow resistance micro-channel liquid cooling heat exchanger based on elastic turbulence and manufacturing method thereof
A liquid-cooled heat exchanger, elastic turbulent flow technology, applied in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., can solve the problems of high heat exchange cost and high flow resistance.
Active Publication Date: 2020-07-28
XI AN JIAOTONG UNIV
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Problems solved by technology
[0006] Aiming at the problems of large flow resistance and high cost of enhanced heat transfer in the existing traditional microchannel liquid cooling heat dissipation technology, the purpose of the present invention is to provide a microchannel liquid cooling heat exchanger with ultra-low flow resistance based on elastic turbulence and its manufacturing method , the heat exchanger has significant advantages such as low flow resistance, high heat transfer coefficient, compact structure, easy realization and long-term stable operation.
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[0035] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0036] see Figure 1 to Figure 4 , the object of the present invention is to utilize "elastic turbulent flow can be in ultra-low Re number (can be as low as Re=10 -2 The principle of being triggered to form an unstable flow under the order of magnitude), combined with the specially designed periodic bending-variable cross-section micro-channel, provides a new type of micro-channel heat exchanger with ultra-low flow resistance and low pump work, Including working fluid (working fluid is viscoelastic fluid, specifically polymer or surfactant solution) and microchannel radiator. See figure 1 , the microchannel heat sink is formed by bonding and sealing the heat dissipation bottom plate 1 and the cover plate 10 . The heat dissipation bottom plate 1 is provided with a working fluid inlet 2, a liquid separation area 3, a number of periodically curved-variable cro...
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Abstract
The invention discloses an ultra-low flow resistance micro-channel liquid cooling heat exchanger based on elastic turbulence and a manufacturing method thereof. The ultra-low flow resistance micro-channel liquid cooling heat exchanger comprises a heat dissipation bottom plate and a cover plate which are bonded and sealed, wherein a working medium inlet, a plurality of periodically bent-variable cross-section micro-channels and a working medium outlet are formed in the heat dissipation bottom plate, the working medium inlet is formed in one end of the heat dissipation bottom plate, the workingmedium outlet is formed in the other end of the heat dissipation bottom plate, a liquid distribution area is communicated with the working medium inlet, one end of the periodically bent-variable-cross-section micro-channel is communicated with the liquid distribution area, the other end of the periodically bent-variable-cross-section micro-channel is communicated with a liquid collection area. Theultra-low flow resistance micro-channel liquid cooling heat exchanger is advantaged in that the periodic bending-variable cross-section combined micro-channel structure and the viscoelastic fluid generate a synergistic effect, an obvious elastic turbulence effect can be generated in the micro-channel with a low Re number, so a heat exchange coefficient under the low Re number is remarkably enhanced, turbulent flow is formed without additionally arranging turbulent flow micro-columns and increasing the flow speed, so the flow pressure drop and the pump power consumption of the micro-channel heat exchanger can be greatly reduced under the same heat exchange condition.
Description
technical field [0001] The invention belongs to ultra-high heat flux microchannel heat dissipation technology, relates to a high-efficiency and compact cooling technology suitable for ultra-high heat flux electronic components, and specifically relates to an ultra-low flow resistance microchannel liquid-cooled heat exchanger based on elastic turbulence and methods of manufacture thereof. Background technique [0002] With the rapid development of micro-nano manufacturing technology (MEMS), electronic components are characterized by high integration, high frequency and miniaturization. While the performance of electronic components is improving, the problem of heat generation has gradually become prominent, and has become the main bottleneck restricting its performance improvement after "Moore's Law". Studies have shown that more than 55% of electronic equipment fails due to overheating. In particular, the third-generation semiconductor devices represented by GaN materials ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/433H01L23/367H01L21/48
CPCH01L23/4336H01L23/367H01L21/4882
Inventor 魏进家杨小平张永海刘蕾冀昕宇
Owner XI AN JIAOTONG UNIV