Preparation method of multi-wavelength laser device
A technology of multi-wavelength lasers and equipment, applied in lasers, laser components, semiconductor lasers, etc., can solve the problems of uncontrollable wavelengths and affecting crystal quality, so as to achieve controllable wavelengths of light, improve luminous efficiency, and good crystal quality Effect
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[0033] A method for preparing a multi-wavelength laser, comprising the steps of:
[0034] a) Put the GaAs substrate into the growth chamber of the MOCVD equipment, 2 Bake at 750±20°C under ambient conditions, and add AsH during baking 3 , remove water and oxygen on the surface of the GaAs substrate, and complete the heat treatment of the GaAs substrate surface;
[0035] b) Lower the temperature in the growth chamber of the MOCVD equipment to 700±20°C, and feed TMGa and AsH 3 , growing a GaAs buffer layer on a GaAs substrate;
[0036]c) Raise the temperature in the growth chamber of the MOCVD equipment to 750±20°C, and feed TMGa, TMAl and AsH 3 , growing n-type Al on the GaAs buffer layer x Ga 1-x As the lower restriction layer;
[0037] d) Reduce the temperature in the growth chamber of the MOCVD equipment to 700±20°C, and feed TMGa, TMAl and AsH 3 , in n-type Al x Ga 1-x Growth of Al on the lower confinement layer of As x Ga 1-x As lower waveguide layer;
[0038] ...
Embodiment 1
[0052] The baking time in step a) is 30 minutes.
Embodiment 2
[0054] The thickness of the GaAs buffer layer in step b) is 100-500nm, and the doping concentration in the growth chamber of the MOCVD equipment is 1E17-5E18 atoms / cm when growing the GaAs buffer layer 3 . Particularly preferably, the thickness of the GaAs buffer layer is 200nm, and the doping concentration in the growth chamber of the MOCVD equipment is 1E18 atoms / cm when growing the GaAs buffer layer 3 .
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