Copper-nickel-manganese alloy electroplating liquid and electroplating method thereof
A technology of electroplating solution and manganese alloy, which is applied in the direction of plating tank, electrolysis process, electrolysis components, etc., can solve the problems of inability to replenish lost ions and poor stability of copper-nickel electroplating solution, so as to improve electroplating effect, consistent ion concentration, and increase quality effect
Active Publication Date: 2020-08-07
佛山市诺诚科技有限公司
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Problems solved by technology
[0004] In order to make up for the deficiencies of the prior art and solve the problems of poor stability of the existing copper-nickel electroplating solution and the inability to replenish lost ions during the electroplating process, the present invention proposes a copper-nickel-manganese alloy electroplating solution and its electroplating method
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[0044]As an embodiment of the present invention, a cylinder one 36 is fixedly installed on the mounting base 13; the piston rod one of the cylinder one 36 is fixedly connected on the lower surface of the fixed plate; Cylinder 2 5 is fixedly installed; said cylinder 2 5 has two in total, and is respectively positioned at the two ends on the length direction of reaction chamber 12; The piston rod 51 of said cylinder 2 5 is fixedly connected on the mesh plate 52; A pipe three 7 is installed on the cylinder one 36; a pipe four 71 is installed on the cylinder two 5; the pipe three 7 is connected with the pipe four 71;
[0045] During work, when the mounting plate 3 inserted with the workpiece descends into the electroplating solution in the electroplating chamber 11, the fixed plate descends equally, because the piston rod one of cylinder one 36 is fixedly connected on the fixed plate; when the fixed plate descends, the cylinder one The gas in the cylinder 36 is compressed, and the...
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The invention belongs to the technical field of electroplating liquid, and particularly discloses copper-nickel-manganese alloy electroplating liquid and an electroplating method thereof. The copper-nickel-manganese alloy electroplating liquid comprises 80-120 g / L of copper sulfate, 10-15 g / L of nickel sulfate, 20-25 g / L of manganese sulfate, 160-180 g / L of sulfuric acid, 5-8 g / L of hydrochloric acid, 5-10 g / L of acetic sodium dodecyl sulfate, 25-30 g / L of a complexing agent, 2-5 g / L of a stabilizer and the balance deionized water. The electroplating liquid is low in cost, good in stability and high in electroplating efficiency, and meanwhile the performance of the plating layer on the surface of a workpiece is excellent after electroplating.
Description
technical field [0001] The invention belongs to the technical field of electroplating solution, in particular to a copper-nickel-manganese alloy electroplating solution and an electroplating method thereof. Background technique [0002] With the continuous development of science and technology, the requirements for products are becoming more and more stringent, and the coating of a single element is difficult to meet the needs of electroplating products. Researchers are gradually turning their attention to alloy electroplating. The nickel plating process is widely used in all aspects of the electroplating industry, and is used for surface treatment of metal devices for anti-corrosion and decoration purposes. However, due to the non-renewable nature of nickel resources, with the continuous increase of nickel consumption, the supply has been seriously insufficient, causing the price to soar. At the same time, the existing copper-nickel alloy electroplating solution still has ...
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Patent Timeline
Login to View More IPC IPC(8): C25D3/58C25D17/02C25D19/00C25D21/10C25D21/14
CPCC25D3/58C25D17/00C25D17/02C25D21/10C25D21/14
Inventor 李鑫齐梦轲
Owner 佛山市诺诚科技有限公司