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A method of electroplating

A technology of electroplating solution and electroplating device, which is applied in the direction of plating tanks, electrolytic components, electrolytic processes, etc., can solve the problems of inability to replenish lost ions, poor stability of copper-nickel electroplating solutions, etc., and achieve improved electroplating effects, high electroplating efficiency, and performance good effect

Active Publication Date: 2021-07-16
佛山市诺诚科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to make up for the deficiencies of the prior art and solve the problems of the poor stability of the existing copper-nickel electroplating solution and the inability to replenish lost ions during the electroplating process, the present invention proposes an electroplating method

Method used

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  • A method of electroplating
  • A method of electroplating
  • A method of electroplating

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Embodiment approach

[0044] As an embodiment of the present invention, a cylinder one 36 is fixedly installed on the mounting base 13; the piston rod one of the cylinder one 36 is fixedly connected on the lower surface of the fixed plate; Cylinder 2 5 is fixedly installed; said cylinder 2 5 has two in total, and is respectively positioned at the two ends on the length direction of reaction chamber 12; The piston rod 51 of said cylinder 2 5 is fixedly connected on the mesh plate 52; A pipe three 7 is installed on the cylinder one 36; a pipe four 71 is installed on the cylinder two 5; the pipe three 7 is connected with the pipe four 71;

[0045]During work, when the mounting plate 3 inserted with the workpiece descends into the electroplating solution in the electroplating chamber 11, the fixed plate descends equally, because the piston rod one of cylinder one 36 is fixedly connected on the fixed plate; when the fixed plate descends, the cylinder one The gas in the cylinder 36 is compressed, and the...

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Abstract

The invention belongs to the technical field of electroplating solution, specifically an electroplating method. The copper-nickel-manganese alloy electroplating solution comprises the following components: copper sulfate 80-120g / L, nickel sulfate 10-15g / L, manganese sulfate 20‑25g / L, sulfuric acid 160‑180g / L, hydrochloric acid 5‑8g / L, sodium lauryl sulfate 5‑10g / L, complexing agent 25‑30g / L, stabilizer 2‑5g / L, the rest The amount is deionized water; the electroplating solution of the present invention has low cost, good stability and high electroplating efficiency, and at the same time, the surface coating performance of the workpiece after electroplating is excellent.

Description

technical field [0001] The invention belongs to the technical field of electroplating solution, in particular to an electroplating method. Background technique [0002] With the continuous development of science and technology, the requirements for products are becoming more and more stringent, and the coating of a single element is difficult to meet the needs of electroplating products. Researchers are gradually turning their attention to alloy electroplating. The nickel plating process is widely used in all aspects of the electroplating industry, and is used for surface treatment of metal devices for anti-corrosion and decoration purposes. However, due to the non-renewable nature of nickel resources, with the continuous increase of nickel consumption, the supply has been seriously insufficient, causing the price to soar. At the same time, the existing copper-nickel alloy electroplating solution still has the problems of poor stability and low electroplating efficiency. In...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/58C25D17/02C25D19/00C25D21/10C25D21/14
CPCC25D3/58C25D17/00C25D17/02C25D21/10C25D21/14
Inventor 李鑫齐梦轲
Owner 佛山市诺诚科技有限公司