Micro pressure sensor chip and preparation method thereof
A micro-pressure sensor and chip technology, applied in piezoelectric/electrostrictive/magnetostrictive devices, instruments, microstructure technology, etc., can solve the problem of susceptibility to the influence of parasitic capacitance, increase of sensor nonlinearity, and increase of signal processing Difficulty and other issues, to achieve the effect of easy processing, good linearity and low cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0045] In order to make the purpose and technical solutions of the present invention clearer and easier to understand. Below in conjunction with the accompanying drawings and examples,
[0050] The depth of the stress adjustment grooves in the array 10 is 20% to 80% of the thickness of the stress film 2 . The first stress concentration groove to the first
[0062] 7) Referring to FIG. 7g, the back surface of the substrate 1 is bonded to the top surface 11 of the anti-overload glass 9 to obtain a micro-pressure sensor chip.
[0064] FIG. 8 is a schematic diagram of the cross-sectional structure relationship of the present invention in an unloaded state. Referring to Figure 9, the sensor is at a slight pressure P
[0074] 7. Chip shape: 5mm×5mm.
PUM
Property | Measurement | Unit |
---|---|---|
Sensitivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com