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Plating solution of high-temperature-resistance oxidation-resistance alloy copper foil and application thereof

A technology of oxidation resistance and high temperature resistance, which is applied in the field of electroplating, can solve the problems of electrolytic copper foil resistance to chemicals and high temperature resistance and oxidation resistance, and achieve fine coating, high thermodynamic stability, and good high temperature corrosion resistance. Effect

Active Publication Date: 2020-08-14
建滔(连州)铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, in order to meet the basic requirements in the production of electrolytic copper foil in my country, electrolytic galvanization is mainly used in the surface treatment process of the substrate. The chemical resistance, high temperature resistance and oxidation resistance of the electrolytic copper foil produced are compared with those of copper foil produced in Japan. there is a clear gap

Method used

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  • Plating solution of high-temperature-resistance oxidation-resistance alloy copper foil and application thereof
  • Plating solution of high-temperature-resistance oxidation-resistance alloy copper foil and application thereof
  • Plating solution of high-temperature-resistance oxidation-resistance alloy copper foil and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0040] Embodiment 1-5 A plating solution for high temperature and oxidation resistant alloy copper foil and preparation method thereof

[0041] Examples 1-5 are the composition, dosage and electroplating process parameters of the plating solution, as shown in Table 1. Among them, " / " means that it does not exist.

[0042] Table 1

[0043] unit Example 1 Example 2 Example 3 Example 4 Example 5 Stannous Sulfate SnSO 4

[0044] The preparation method of the above-mentioned high temperature and oxidation resistant alloy copper foil includes the conventional steps of pickling, roughening, sealing, weak roughening, galvanizing tin alloy, passivation, water washing, surfactant treatment and drying. The zinc-tin alloy step adopts the plating solution and electroplating process parameters in the above table, the anode plate is a titanium plate, and a 35-micron high temperature and oxidation resistant alloy copper foil is prepared.

Embodiment 6-10

[0055] Embodiment 6-10 A plating solution for high temperature and oxidation resistant alloy copper foil and preparation method thereof

[0056] The composition, dosage and electroplating process parameters of the plating solution are shown in Table 2. Among them, " / " means that it does not exist.

[0057] Table 2

[0058] unit Example 6 Example 7 Example 8 Example 9 Example 10 Stannous Sulfate SnSO 4

[0059] The preparation method of the above-mentioned high temperature and oxidation resistant alloy copper foil includes the conventional steps of pickling, roughening, sealing, weak roughening, galvanizing tin alloy, passivation, water washing, surfactant treatment and drying. The zinc-tin alloy step adopts the plating solution and parameters in the above table, the anode plate is a zinc plate, and a 35-micron high temperature and oxidation resistant alloy copper foil is prepared.

Embodiment 11-15

[0068] Embodiment 11-15 A plating solution for high temperature and oxidation resistance alloy copper foil and preparation method thereof

[0069] The composition, dosage and electroplating process parameters of the plating solution are shown in Table 3. Among them, " / " means that it does not exist.

[0070] table 3

[0071] unit Example 11 Example 12 Example 13 Example 14 Example 15 Stannous Sulfate SnSO 4

[0072] The preparation method of the above-mentioned high temperature and oxidation resistant alloy copper foil includes the conventional steps of pickling, roughening, sealing, weak roughening, galvanizing tin alloy, passivation, water washing, surfactant treatment and drying. The zinc-tin alloy step adopts the plating solution and parameters in the above table, the anode plate is a titanium plate, and a 35-micron high temperature and oxidation resistant alloy copper foil is prepared.

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Abstract

The invention discloses a plating solution of high-temperature-resistance oxidation-resistance alloy copper foil and application thereof. The plating solution is prepared from stannous sulfate, zinc sulfate, auxiliary additives, a brightener and water, wherein the auxiliary additives are from at least two of citric acid, tartaric acid, sodium gluconate, ammonium sulfate, triethanolamine, polyethylene glycol alkyl ether and vanilline, and the brightener is peptone and / or gelatin. The application refers to application of the plating solution in preparing the high-temperature-resistance oxidation-resistance alloy copper foil. A manufactured copper foil cladding layer is fine, smooth and bright. The copper foil has high thermodynamic stability and high resistance to high-temperature corrosion,and can be used for manufacturing high-precision printed circuit boards.

Description

Technical field [0001] The present invention relates to the technical field of electroplating, and in particular to a plating solution for high temperature and oxidation resistant alloy copper foil and its application. Background technique [0002] As one of the basic materials of the electronics industry, electrolytic copper foil is widely used in the electronics industry and plays a very important role in the development of the entire electronics industry. Electrolytic copper foil is a suitable electrolyte solution under the action of a certain current density, and the metal copper deposition layer obtained by electrodeposition technology is widely used in the production of copper clad laminates (abbreviated as CCL) and printed circuit boards (abbreviated as PCB). [0003] The quality of electrolytic copper foil is not only related to the raw foil substrate, but also closely related to the surface treatment technology of copper foil. With the development of high-density and mult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56C25D3/60C25D7/06
CPCC25D3/565C25D3/60C25D7/0614
Inventor 林家宝
Owner 建滔(连州)铜箔有限公司
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