Bonding processing method and system
A processing method and bonding technology, applied in the direction of connecting components, material gluing, special surfaces, etc., can solve the problems of high performance requirements of the carrier, low product processing efficiency, high energy consumption, etc. The effect of wax, reduction of process energy consumption, and green environmental protection of the manufacturing process
Inactive Publication Date: 2020-08-21
CHONGQING SILIAN OPTOELECTRONICS SCI & TECH
View PDF3 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a bonding processing method and system for solving the problem of high-temperature baking required in the prior art wax application process, huge energy consumption, and the impact of wax cleaning on the carrier. High performance requirements, low product processing efficiency and other issues
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0040] The UV glue of this embodiment was purchased from Shenzhen Kangtaisheng Electronic Materials Co., Ltd., model KS-8200A.
[0041] The model of the sapphire substrate in this embodiment is 4 inches, that is, the diameter is about 100 mm, and the thickness is 690 μm.
[0042]The equipment used in this embodiment is Chenxuan automatic placement machine, the model is CZTL-01, which is purchased from Suzhou Chenxuan Optoelectronics Technology Co., Ltd., and a UV curing lamp and a curing workbench are added at the delivery end of the equipment to carry out UV curing process.
[0043] figure 1 Shown is the sapphire substrate UV glue bonding process flow chart of this embodiment.
[0044] The specific process flow is as follows: carrier preparation → substrate, UV glue preparation → workpiece cloth glue → substrate bonding → air pressing → substrate UV light curing → delivery, a total of 7 steps.
[0045] During the vehicle preparation process, wipe the vehicle with clean tes...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| Diameter | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a bonding processing method and system. The method comprises the following steps that a to-be-bonded part of a to-be-processed product is coated with an ultraviolet glue, then the product is attached to a carrier, and is cured by using ultraviolet light illumination, so that the to-be-processed product is bonded to the carrier. According to the bonding processing method, anUV glue bonding new method is adopted to replace a traditional wax pasting process, wax pasting, wax removing and cleaning process links are omitted, the process energy consumption is greatly reduced,the problem of original wax polishing sheet sliding at a high temperature, and the problem of liquid wax recovery processing are solved, so that manufacturing processes of a sapphire substrate and other products become green and environmentally friendly.
Description
technical field [0001] The invention relates to the technical field of bonding processing, in particular to a bonding processing method and system based on shadowless glue. Background technique [0002] When processing devices such as a substrate, it is usually necessary to fix them on a carrier first. In the prior art, liquid wax is usually used for bonding and fixing, and this method has many defects. [0003] For example, in the existing sapphire substrate bonding process, liquid wax is used as the adhesive. Through high-strength adhesive force, the sapphire substrate is bonded to the carrier. In the subsequent processing, the substrate is further processed. processing to bring it up to the relevant level. The shortcomings of the traditional waxing process are more prominent, mainly including: the carrier and the wax need to be baked at high temperature before and during the lamination, which consumes a lot of energy, and requires the use of multiple heating tables for h...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): B05D5/10B05D3/06F16B11/00
CPCB05D5/10B05D3/067F16B11/006
Inventor 赵伟曾念曹航邓天海
Owner CHONGQING SILIAN OPTOELECTRONICS SCI & TECH