Circulating type chemical cleaning system for semiconductor processing

Abstract

The invention discloses a circulating type chemical cleaning system for semiconductor processing, and relates to the technical field of semiconductor processing. A circulating type feeding mechanism and a circulating type utilization mechanism are fixedly installed on the top end face of an equipment bearing base plate; the circulating type feeding mechanism and the circulating type chemical cleaning liquid utilization mechanism form a double-circulation working mode of the whole system; during normal use, the circulating type feeding mechanism can continuously supply silicon wafers to be cleaned to a subsequent cleaning structure, and the continuity of the whole silicon wafer cleaning work is ensured; in addition, chemical cleaning liquid with impurities is returns to the circulating typeutilization mechanism again, and passes through a filtering structure arranged in the circulating type utilization mechanism, so that the chemical cleaning liquid with the impurities removed is reused, the cleaning cost can be reduced, and pollution to the environment is reduced; and the effect of greatly improving the cleaning efficiency is reflected on the whole due to a double-circulation working mode.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a circulation chemical cleaning system for semiconductor silicon wafer processing. Background technique [0002] A semiconductor is a substance with an electrical conductivity between an insulator and a conductor. Its electrical conductivity is easy to control and can be used as a component material for information processing. From the perspective of technology or economic development, semiconductors are very important. The core unit of many electronic products, such as computers, mobile phones, and digital tape recorders, utilizes changes in the conductivity of semiconductors to process information. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in commercial applications among various semiconductor materials. [0003] Silicon wafers are the most important semiconductor material, and m...

AI Technical Summary

Problems solved by technology

[0007] First of all, the above-mentioned patent uses the reaction kettle as the container for cleaning the entire silicon wafer, and the technical features include the negative pressure adsorption and fixation of the silicon wafer. During the process, the lid of the reactor is always open, that is, the inner cavity of the entire reactor is at atmospheric pressure, and the silicon wafer itself has a certain gravity, and because the silicon wafer does not add liquid during the adsorption and fixation stage, there is no There is a saying that the buoyancy is greater than the gravity of the silicon chip itself, and then suspended in the liquid, providing the accurate position of negative pressure adsorption, that is, the silicon chip should be located at the bottom of the reactor before adsorption, and the negative pressure adsorption point set in the above patent content, It is located in the middle of the side of the reactor or even close to the top, so there will be a problem that the silicon wafer fixing effect is not ideal;

[0008] In addition, the above-mentioned patent uses ultrasonic cleaning to clean the silicon wafer. When the ultrasonic cleaning is working, the pressure formed can reach tens of megapascals or even hundreds of megapascals. Such a large pressure acts on the surface of the silicon wafer. The surface of the silicon wafer is cracked or damaged, which will cause a high probability of the silicon wafer becoming a waste product;

Images