Laser sleeving-nesting type composite processing method

A technology of compound processing and processing scheme, which is applied in the field of laser nested compound processing, can solve problems such as not applicable to the field of micro-nano manufacturing, complex process steps, clamping errors, etc., to improve processing quality, simplify processing flow, and reduce position effect of error

Pending Publication Date: 2020-08-28
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, both of the above two patented methods require rough machining first and then finish machining, which complicates the process steps, and there are clamping errors in the secondary clamping performed at the same time, which is not suitable for the field of micro-nano manufacturing

Method used

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  • Laser sleeving-nesting type composite processing method
  • Laser sleeving-nesting type composite processing method
  • Laser sleeving-nesting type composite processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Such as figure 1 and 2 As shown, a laser nested compound processing method comprises the following steps:

[0052] (1) Analysis of the workpiece: the workpiece is copper metal, and the workpiece must be processed with high efficiency and high quality of small-diameter circular through-holes, and the copper has a low absorption rate for the laser with a wavelength of 10.6 μm;

[0053] (2) Processing mode setting: select the nesting mode of the outer laser beam and the embedded laser beam;

[0054] (3) Processing parameter setting: the processing parameters of the selected jacket laser beam 101 are the wavelength of 10.6 μm, the pulse width range of 100 ns, the output energy power adjustment range of 15 W, the repetition frequency range of 100 kHz, the defocus amount of 0 mm, and the processing method It is circular processing; the processing parameters of the embedded laser beam 201 are selected as wavelength 10.6μm, pulse width range is 20fs, output energy power adjus...

Embodiment 2

[0057] Such as figure 1 and 3 As shown, a laser nested compound processing method comprises the following steps:

[0058] (1) Workpiece analysis: The workpiece is made of aluminum alloy metal material, and the workpiece must realize efficient and high-quality processing of large-diameter circular blind holes;

[0059] (2) Processing mode setting: select the nesting mode of the outer laser beam and the embedded laser beam;

[0060] (3) Processing parameter setting: Therefore, the processing parameters of the selected jacket laser beam 102 are wavelength 1064nm, pulse width range is 80fs, output energy power adjustment range is 2W, repetition frequency range is 100kHz, defocusing amount is 0mm, processing method It is ring processing; the processing parameters of the embedded laser beam 202 are selected as wavelength 532nm, pulse width range is 40ns, output energy power adjustment range is 8W, repetition frequency range is 100kHz, defocus amount is 0mm, and the processing meth...

Embodiment 3

[0063] Such as figure 1 and 4 As shown, a laser nested compound processing method comprises the following steps:

[0064] (1) Workpiece analysis: The workpiece is made of ceramic material, because the workpiece needs to realize efficient processing of small diameter circular blind holes;

[0065] (2) Processing mode setting: select the nesting mode of the outer laser beam and the embedded laser beam;

[0066] (3) Processing parameter setting: Therefore, the processing parameters of the selected jacket laser beam 103 are wavelength 355nm, pulse width range is 80fs, output energy power adjustment range is 5W, repetition frequency range is 100kHz, defocusing amount is 0mm, processing method For percussion processing, and carry out airspace shaping to form an annular spot; the processing parameters of the selected embedded laser beam 203 are wavelength 1064nm, pulse width range 200ns, output energy power adjustment range 20W, repetition frequency range 100kHz, defocus amount is...

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Abstract

The invention relates to the technical field of laser processing, in particular to a laser sleeving-nesting composite processing method. The laser sleeving-nesting composite processing method comprises the following steps that (1) workpiece analysis is carried out, wherein processing characteristics of a workpiece are analyzed, and meanwhile, an optimal processing scheme suitable for the workpieceis generated; (2) a processing mode is set, and specifically a sleeving-nesting mode of a sleeving laser beam and a nested laser beam is selected; (3) processing parameters are set, and specificallyprocessing parameter setting is carried out on the sleeving laser beam and the nested laser beam which are set in the step (2); and (4) the workpiece is processed, and specifically, laser processing is carried out on the workpiece according to the set processing parameters in the step (3) and the optimal processing scheme in the step (1). According to the laser sleeving-nesting composite processing method, rough processing and finish processing of laser composite processing materials are achieved at a time through mutual nesting of different laser beams, the processing process is simplified, meanwhile, repeated clamping is not needed in one-time processing, and position errors caused by repeated clamping are reduced.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser nesting composite processing method. Background technique [0002] Laser processing is non-contact processing, which has the advantages of high precision, good directionality, and no tool wear, and is widely used in the field of machinery manufacturing. In recent years, with the continuous breakthrough of laser technology, laser processing technology has shown advantages that other manufacturing technologies do not have in the field of mechanical micro-nano manufacturing, such as no material selectivity, manufacturing of nanostructures, and increased manufacturing speed. The promotion of the application of processing technology in the field of mechanical micro-nano manufacturing has become more and more stringent for the reduction of micro-defects in laser processing. Laser processing mainly has defects such as thermal damage, micro-cracks, and nano-scaled layers...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00
CPCB23K26/00B23K2103/10
Inventor 王成勇唐梓敏郑李娟杜策之黄欣胡小月吴茂忠
Owner GUANGDONG UNIV OF TECH
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