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A method of loading and unloading PECVD surface coating

A surface coating and coating technology, which is applied in the direction of gaseous chemical plating, metal material coating technology, sustainable manufacturing/processing, etc., can solve the problem of no silicon wafer coating detection in the graphite boat, no coating, and affecting the production efficiency of the entire line Solve problems such as battery quality, achieve safety and non-contact, improve quality, and stabilize efficiency

Active Publication Date: 2022-05-03
HUNAN RED SUN PHOTOELECTRICITY SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these two methods are for single-piece detection in the inserting machine, which can detect whether the single piece is fragmented or cracked before entering the graphite boat, and whether the coating thickness and uniformity meet the requirements before entering the next process flower basket after coating. and other inspections, but none of them have tested whether the silicon wafer in the graphite boat is coated or not.
Therefore, it is easy to have repeated coating on the whole boat or no coating on the whole boat, which will affect the production efficiency of the whole line and the quality of the cells

Method used

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  • A method of loading and unloading PECVD surface coating
  • A method of loading and unloading PECVD surface coating
  • A method of loading and unloading PECVD surface coating

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Embodiment Construction

[0051] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0052] Such as figure 1 and figure 2 As shown, the loading and unloading method of the PECVD surface coating of the present embodiment comprises the following steps:

[0053] S1. The graphite boat is in place: the graphite boat 1 inserted by the inserting and unloading machine moves to the bottom of the PECVD purification table through the conveying mechanism 2. The chip taker inserts the silicon chip into the graphite boat 1;

[0054] S2. Cache shelf on the graphite boat: the manipulator grabs the graphite boat 1 and puts it on the cache shelf of the clean bench to wait;

[0055] S3. The pushing mechanism on the graphite boat: there is space in the reaction chamber 3, and the manipulator grabs the graphite boat 1 on the buffer rack and puts it on the pushing mechanism 4;

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Abstract

The invention discloses a material loading and unloading method for PECVD surface coating, which comprises a graphite boat in place, a graphite boat upper buffer frame, a graphite boat upper pushing mechanism, a coating detection before entering the boat, a graphite boat entering a reaction chamber, and a graphite boat exiting the reaction chamber , Transfer mechanism on the graphite boat, coating inspection before taking the film, graphite boat returning to the inserting and taking machine and other steps. The present invention adds two steps of coating detection step on the only way of the graphite boat, one of which is used to detect whether the silicon chip in the graphite boat that is about to enter the reaction chamber on the push boat mechanism has been coated, so as to avoid secondary coating in the reaction chamber , the second is used to detect whether the silicon wafers that will enter the inserting machine on the transfer mechanism are coated or not, so as to prevent the uncoated silicon wafers from flowing into the next process, so as to ensure that each boat of silicon wafers is coated and there is no repeated coating. The smooth production process is guaranteed, the efficiency of silicon wafers is more stable, and the quality of cells is improved.

Description

technical field [0001] The invention relates to a PECVD surface coating process, in particular to a method for loading and unloading PECVD surface coatings. Background technique [0002] PECVD (Plasma Enhanced Chemical Vapor Deposition, PECVD equipment includes three parts, namely gas source cabinet, furnace cabinet and purification platform, the reaction chamber is located in the furnace cabinet; the pusher mechanism, buffer rack, and manipulator are located in the purification platform; the transmission mechanism is connected to the purification platform. Taiwan and inserting chip machine) refers to the vapor phase deposition method of plasma enhanced chemistry. In the PECVD surface coating process, the graphite boat is the carrier of the solar cell, and the silicon wafer is processed into a solar cell after several processes, and the surface coating is one of the core processes of the solar cell processing. The graphite boat is the carrier of the solar cells in the surfa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01L21/66H01L21/677C23C16/50C23C16/52C23C16/54
CPCH01L31/1804H01L31/1876H01L22/12H01L22/20H01L21/67739C23C16/50C23C16/54C23C16/52Y02P70/50
Inventor 朱辉成秋云刘帅梁浩石书清罗志敏
Owner HUNAN RED SUN PHOTOELECTRICITY SCI & TECH
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