Semiconductor element processing method and forming process

Abstract

The invention discloses a semiconductor element processing method and a forming process. The method comprises the steps of taking a semiconductor wafer subjected to double-sided photoetching as a processing object; coating the upper surface and the lower surface of the semiconductor wafer with soldering paste, completing double-sided coating of the soldering paste to obtain a semi-finished productof the semiconductor element, feeding the semi-finished product of the semiconductor element into scribing equipment, cutting the semi-finished product of the semiconductor element into a plurality of small blocks, moving the cut small blocks to a lead frame for packaging, and performing finished product testing on the packaged small blocks to obtain the semiconductor element. The semiconductor element processing method is simple and feasible in process, good in solder paste layer coating and fixing effect, capable of effectively preventing the surface of the semiconductor chip from being oxidized, capable of improving the compactness of the surface of the semiconductor chip and high in reliability. According to the forming process, the scribing equipment is used for preparing the semiconductor element, the scribing equipment is high in automation degree and high in feeding and discharging speed, and the production efficiency of the semiconductor element is effectively improved.

Description

technical field [0001] The invention relates to the field of semiconductor elements, in particular to a semiconductor element processing method and molding process. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. From a perspective, the importance of semiconductors is huge. Most of the chips in electronic products, such as computers, mobile phones or digital recorders, are components made of semiconductors. [0003] The surface of the existing semiconductor chip does not have a solder paste layer, and it needs to be welded together with the lead frame through the soldering sheet. However, the surface of the semiconductor chip without the solder paste layer on the surface is easy to oxidize, and even has a c...

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide a semiconductor element processing method and molding process: (1) by taking the semiconductor wafer through double-sided photolithography as the processing object, the semiconductor wafer is put into the printing The fixed platform of the machine, use the printing machine to apply the solder paste on the upper surface of the semiconductor wafer, then take out the semiconductor wafer, and put it into the oven to dry, so that the solder paste layer on the upper surface of the semiconductor wafer is hardened, and then turn over the semiconductor wafer, Use a printing machine to coat the solder paste on the lower surface of the semiconductor wafer, then put the semiconductor wafer into an oven to dry, so that the solder paste layer on the lower surface of the semiconductor wafer is hardened, and the solder paste is coated on both sides to obtain a semiconductor Component semi-finished products, the semiconductor component semi-finished products are sent to the dicing equipment to cut out several small pieces, the cut small pieces are moved to the lead frame for packaging, and the packaged small pieces are tested for finished products to obtain the semiconductor components. (2) by putting the semi-finished semiconductor element into the first automatic loading and unloading mechanism of the dicing equipment or the feeding suction cup on the second automatic loading and unloading mechanism, start the lifting mechanism to drive The feeding box and the unloading box rise up, so that the feeding suction cup contacts the semi-finished semiconductor element, and the feeding suction cup operates to absorb the semi-finished semiconductor element, and the L-shaped plate is driven to rotate by the stepping motor, and the semi-finished semiconductor element is moved to the front of the scribing board. Above, adjust the height of the feeding suction cup through the lifting cylinder, release the feeding suction cup, place the semi-finished semiconductor component on the dicing board, release the high-energy laser through the operation of the high-energy laser generator, and push the second slide rail to move through the operation of the first cylinder. Changing the horizontal position of the high-energy laser generator on the scribing board, moving the C-shaped mounting frame through the operation of the second cylinder, changing the longitudinal position of the high-energy laser generator on the scribing board, and realizing the second high-energy release of the high-energy laser generator The laser cuts semi-finished semiconductor components into small pieces, which solves the problem of low production efficiency of existing semiconductor chips

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