Anode copper ball anti-drop cylinder efficiency improvement device

Abstract

The invention discloses an efficiency raising device for an anode copper ball anti-dropping cylinder, which comprises a plating cylinder equipped with an electroplating solution and a feeding device, and the feeding device includes a material receiving component, a material receiving variable diameter component, a titanium basket, and a material receiving bracket , at least one support assembly is arranged horizontally in the middle of the plating cylinder, the support assembly carries the material receiving assembly on the top of the plating cylinder through the material receiving bracket, and several installation positions opened in the middle of the material receiving assembly pass through the material receiving variable diameter assembly and titanium The baskets are connected, and the titanium baskets are arranged transversely along the support assembly to be suspended in the middle of the plating tank. By arranging at least one supporting component horizontally in the middle of the plating tank, the supporting component carries the material receiving component on the top of the plating tank through the material receiving bracket, and several installation positions in the middle of the material receiving component are connected with the titanium basket through the material receiving variable diameter component to solve the problem. In the process of adding phosphor bronze balls, phosphor bronze balls are easy to fall into the plating tank, affecting the quality of later circuit boards; effectively reducing safety hazards, reducing the cleaning process of later plating tanks and the loss of electroplating solution, and reducing production costs.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an efficiency raising device for an anode copper ball drop prevention cylinder. Background technique [0002] The electroplating process is the process of plating metal or alloy deposits on the surface of circuit boards and other parts using the principle of electrolysis, and is an important link in the production process of circuit boards. During the electroplating process, an anode titanium basket is suspended in a plating tank filled with electroplating solution, and spherical phosphor bronze is added to the titanium basket. Regular maintenance is required to replenish phosphor bronze balls as production progresses. Existing electroplating equipment usually needs to manually add phosphor bronze balls to the titanium basket in the plating tank, but the phosphor bronze balls are easy to fall into the plating tank during the adding process During the process,...

AI Technical Summary

Problems solved by technology

Regular maintenance is required to replenish phosphor bronze balls as production progresses. Existing electroplating equipment usually needs to manually add phosphor bronze balls to the titanium basket in the plating tank, but the phosphor bronze balls are easy to fall into the plating tank during the adding process During the process, the phosphorus copper balls falling into the tank were corroded and dissolved by the electroplating solution, forming copper slag particles, resulting in quality defects such as open circuits and gaps in the later processing, and the plating tank needs to be cleaned regularly, and production needs to be stopped every time it is cleaned. The phosphor bronze balls falling on the bottom can only be seen after the electroplating solution in the plating tank is pumped out. After the phosphor bronze balls in the tank are cleaned manually, the phosphor bronze balls can be filled into the titanium basket. The degree of dependence on labor Higher, there is a greater potential safety hazard, and the loss of the electroplating solution is greater, and the production cost is higher

Images