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Novel soft insulation heat conduction pad

An insulating, heat-conducting and soft technology, applied in the field of heat-conducting pad and its preparation, can solve the problems of high price of silica gel and complicated preparation method, and achieve the effect of reducing manufacturing cost and difficulty, and excellent shock absorption function.

Pending Publication Date: 2020-09-18
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high price of silica gel and the complicated preparation method have become the main problems in the production of thermal pads at present.

Method used

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  • Novel soft insulation heat conduction pad
  • Novel soft insulation heat conduction pad
  • Novel soft insulation heat conduction pad

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0020] Specific implementation mode 1: The preparation method of a new type of soft insulating heat conduction pad in this implementation mode is as follows:

[0021] Step 1: Add light-colored thermally conductive fillers and dark-colored thermally conductive fillers to the coupling agent hydrolyzate for surface treatment.

[0022] Step 2: Mix and stir the flexible epoxy resin and its corresponding curing agent at room temperature for 20 minutes, then vacuum defoam for 30 minutes, take 1 / 3 of the mixed solution as liquid A, and the remaining 2 / 3 as liquid B.

[0023] Step 3: Add the surface-treated light-colored thermally conductive filler in step 1 to the liquid A obtained in step 2 and mix and stir for 1 hour. After the stirring is completed, record it as liquid C, and then add the surface-treated dark thermally conductive filler in step 1 to B obtained in step 2. The solution was mixed and stirred for 1 hour, and recorded as D solution after the stirring was completed.

[...

specific Embodiment approach 2

[0026] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the light-colored filler described in step 1 is one of alumina and aluminum nitride; the dark heat-conducting filler is one of graphite and copper powder. A combination of two or two, among which the particle size ratio of graphite to copper powder is 1:5. Others are the same as the first embodiment.

specific Embodiment approach 3

[0027] Specific implementation mode three: the difference between this implementation mode and specific implementation mode one or two is: the operation steps of step one and step three are omitted. Others are the same as the first or second embodiment.

[0028] Below in conjunction with specific embodiment and comparative example, the present invention is described further:

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Abstract

The invention discloses a novel soft insulation heat conduction pad, and relates to a soft insulation heat conduction pad. The whole heat conduction pad has a double-layer structure, the upper layer of the heat conduction pad is a light-color soft insulation layer, and the lower layer is a dark-color soft non-insulation layer. When the heat conduction pad is applied to an electric appliance, the light-color layer is attached to a heating element, the dark-color layer is attached to a shell or a radiator, and the effects of insulation and heat conduction are achieved by transferring heat of theheating element to the shell or the radiator. The heat conduction pad comprises flexible epoxy resin, a heat conduction filler and a coupling agent. The heat conduction pad has the effects of insulation, heat conduction, shock absorption and sealing. The flexible epoxy resin is used for replacing silica gel in a traditional method to serve as a matrix, and the manufacturing cost and the operationdifficulty are reduced. In addition, a double-layer structure is adopted, and the insulation and heat conduction properties of the product are enhanced. The heat conduction pad is applied to the field of heat conduction materials.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a heat-conducting pad and its preparation method and application. Background technique [0002] Heat dissipation is a problem that all heat-generating devices need to consider at present, and untimely heat dissipation has become the main cause of damage to most electronic equipment. The current heat dissipation method is to use the thermal interface material as a heat conduction bridge to transfer heat from the heat source to the outside world. The most common thermal interface materials are: thermal paste, thermal adhesive, thermal pad, etc. These thermal interface materials are widely used in mobile phones, computers, refrigerators, and energy vehicles. [0003] The thermal pad is a gap-filling thermal interface material with thermal conductivity, which is mainly used for the transfer interface between the heating device and the heat sink or the outside worl...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K9/04C08K3/22C08K3/28C08K3/04C08K3/08C09K5/14
CPCC08K9/06C08K9/04C08K3/22C08K3/28C08K3/04C09K5/14C08K2003/282C08K2003/085C08K2003/2227
Inventor 李丽波李星海阎思奇杜立涛蒋奇宇翟墨杜金田
Owner HARBIN UNIV OF SCI & TECH