Integrated interconnection structure of self-airtight packaging function module and implementation method

Abstract

The invention provides an integrated interconnection structure of a self-airtight packaging function module. The integrated interconnection structure comprises the self-airtight packaging function module, a structure switching layer and a system mother board, wherein the self-airtight packaging function module is welded on the system motherboard through the structure switching layer, a heat dissipation micro-channel port of the self-airtight packaging function module is connected to a micro-channel interface of the system motherboard through windowing of the structure switching layer, and theself-airtight packaging function module is in signal interconnection with the system motherboard through a BAG ball. Through the introduction of the metal structure switching layer, the BGA vertical interconnection of high/low-frequency electric signals of the self-airtight packaging function module and interface connection of a built-in micro-channel and a system heat dissipation channel are realized at the same time; high-frequency/low-frequency electrical interconnection and heat dissipation channel interface connection between the function module and an external system are integrally achieved; thermal mismatch between the function module and a system mother board is relieved through optimization of the material of the structure switching layer, the assembly strength is improved by increasing the welding area, and therefore the overall reliability of the system is improved.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to an integrated interconnection structure and a realization method of self-hermetic packaging functional modules. Background technique [0002] In the prior art, the multi-layer ceramic circuit substrate represented by LTCC technology and its multi-functional packaging module, with its excellent high-frequency performance, high integration density and high reliability, are used in airborne, spaceborne, Electronic information equipment platforms such as missiles have been widely used. With the further improvement of the miniaturization and lightweight requirements of the information equipment system, the multi-functional functional unit must achieve smaller volume, richer functions, and more compact interconnection. The integration form of products is gradually changing from the traditional hybrid integration. In the transition to self-hermetic packaging integration based on mul...

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Problems solved by technology

The paper "Finite Element Simulation of Microchannel Aluminum Substrate for High Power LED Heat Dissipation" analyzed and optimized the heat dissipation characteristics of aluminum substrates containing microchannels in LED applications, and the paper "Research on Thermal Resistance of High Power LED Array Based on Microchannel Heat Dissipation" The thermal resistance model of silicon substrate microchannels in LED applications, the paper "Experimental Research on Heat Dissipation Performance of Typical Microchannel Liquid-cooled Cold Plates" studied the influence of microchannel structures in metal cold plates on the heat dissipation performance, the paper "Microchannel Cold Plates Research on Processing Technology and Heat Dissipation Performance" studied the forming process and heat dissipation performance of metal micro-channel cold plates. Channel heat sink, used for heat dissipation of high-power lasers, the papers "Experimental Research on Heat Dissipation of Honeycomb Laminated Microchannel Heat Sink Based on Disturbance" and "Experimental Research on Heat Dissipation Based on a Microchannel Heat Sink" studied a honeycomb metal micro The heat dissipation effect of the channel heat sink, the paper "Research on Welding Technology and Forming Process of High-Efficiency Heat Dissipation Micro-channel Liquid-cooled Cold Plate" optimizes the welding effect of aluminum micro-channel cold plate, most of these studies focus on the field of active devices or metal cold plates, None of them involve the packaging of multi-functional circuit modules, the electrical interconnection between the package and external systems, and the connection of micro-channel interfaces.

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