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Application of resin composition in preparation of insulating substrate or copper-clad laminate

A technology for copper-clad laminates and resin compositions, which is applied in the field of preparing insulating substrates or copper-clad laminates and resin compositions, can solve the problems of complex preparation methods of prepolymers, achieve improved glass transition temperature, and be difficult Water absorption, efficiency improvement effect

Active Publication Date: 2020-10-16
派迈新材料(成都)有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation method of the prepolymer is relatively complicated, and a large amount of organic solvent is also used

Method used

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  • Application of resin composition in preparation of insulating substrate or copper-clad laminate
  • Application of resin composition in preparation of insulating substrate or copper-clad laminate
  • Application of resin composition in preparation of insulating substrate or copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Embodiment 1, the preparation of high-frequency high-speed copper-clad laminate of the present invention

[0054] Blend dicyclopentadiene and ruthenium carbene catalyst at a weight ratio of 10000:2, stir and mix evenly to obtain glue, select 200*200mm E-glass fiber cloth, apply the above glue evenly, and cure at 60°C for 10 minutes , to obtain an insulating substrate. Coat the surface of 35 micron thick copper foil with phenolic resin adhesive (you can also apply phenolic resin adhesive on both sides of the insulating substrate), then place two pieces of copper foil on both sides of the insulating substrate respectively, and place them in a vacuum hot press machine to press to obtain For copper clad laminates, the temperature and time of vacuum hot pressing are 150°C for 10 minutes.

[0055] The ruthenium carbene catalyst used in this embodiment is

Embodiment 2

[0056] Example 2. Preparation of high-frequency and high-speed flame-retardant copper-clad laminates of the present invention

[0057] Blend dicyclopentadiene, ruthenium carbene catalyst, silica glass beads, and decabromodiphenylethane according to a weight ratio of 10000:2:5000:1000, stir and mix evenly to obtain a glue solution, select 200*200mm E-glass fiber cloth, evenly coated with the above glue, cured at 60°C for 10 minutes to obtain an insulating substrate. Coat the surface of 35 micron thick copper foil with phenolic resin adhesive (you can also apply phenolic resin adhesive on both sides of the insulating substrate), then place two pieces of copper foil on both sides of the insulating substrate respectively, and place them in a vacuum hot press machine to press to obtain For copper clad laminates, the temperature and time of vacuum hot pressing are 150°C for 10 minutes.

[0058] The ruthenium carbene catalyst used in this embodiment is

Embodiment 3

[0059] Embodiment 3, the preparation of high-frequency high-speed copper-clad laminate of the present invention

[0060] Cycloolefin compounds (composed of dicyclopentadiene and norbornene, the weight ratio of dicyclopentadiene and norbornene is 9:1), ruthenium carbene catalyst, silica glass beads, hexabromocyclododeca Alkanes are blended according to the weight ratio of 10000:2:5000:1000, stirred and mixed evenly to obtain glue, select 200*200mm E-glass fiber cloth, apply the above glue evenly, and cure at 60°C for 10 minutes to obtain insulation substrate. Coat the surface of 35 micron thick copper foil with phenolic resin adhesive (you can also apply phenolic resin adhesive on both sides of the insulating substrate), then place two pieces of copper foil on both sides of the insulating substrate respectively, and place them in a vacuum hot press machine to press to obtain For copper clad laminates, the temperature and time of vacuum hot pressing are 150°C for 10 minutes.

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Abstract

The invention provides an application of a resin composition in preparation of an insulating substrate or a copper-clad laminate, and belongs to the field of electronic materials. The resin composition is prepared from the following raw materials in parts by weight: 9000-10000 parts of a cycloolefin compound containing one or two double bonds and at least one bridge ring, and 0.1-10 parts of a ruthenium carbene catalyst. The insulating substrate is prepared from the specific resin composition, and the copper-clad plate is further prepared so that the glass-transition temperature of the copper-clad plate or the insulating substrate is effectively increased, the dielectric loss can be effectively reduced during use, and the application requirements of high-frequency and high-speed communication are met. Meanwhile, the insulating substrate or the copper-clad plate prepared from the resin composition has good flame resistance and dip soldering resistance, is not easy to absorb water, and is more suitable for preparing electronic materials. In addition, the preparation method is safe and environment-friendly. The insulating substrate is prepared from the resin composition, and then theprepared copper-clad plate can be used for high-frequency and high-speed communication, especially 5G communication, and has a good application prospect.

Description

technical field [0001] The invention belongs to the field of electronic materials, and in particular relates to the use of a resin composition in preparing insulating substrates or copper-clad laminates. Background technique [0002] In many electronic products, printed circuit boards (PCBs) play the role of circuit interconnection and are an indispensable part of electronic products. Printed circuit boards (PCBs) are manufactured by etching copper clad laminates (CCL, referred to as copper clad laminates) to obtain related circuits. Copper-clad laminate (CCL) refers to a plate-shaped material formed by impregnating the reinforcing material with resin, covered with copper foil on one or both sides, and hot-pressed. It is the basic material for manufacturing printed circuit boards (PCBs). . [0003] In the production of commonly used single-sided or double-sided PCBs, a series of operations (such as etching, electroplating, drilling, etc.) are performed on the copper-clad b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F132/08C08F232/08C08F4/80B32B15/08B32B15/082B32B15/20B32B27/20B32B27/28B32B27/30
CPCC08F132/08C08F232/08C08F4/80B32B27/20B32B27/28B32B27/30B32B27/308B32B15/20B32B15/08B32B15/082B32B2307/206B32B2307/3065B32B2307/204B32B2307/73B32B2457/08
Inventor 胡革
Owner 派迈新材料(成都)有限责任公司
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