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A curable organosilicon composition and its preparation method and application

A composition and silicone technology, applied in coatings, semiconductor devices, adhesives, etc., can solve problems such as unseen and changed defects, and achieve increased cross-linking density, tensile strength, and high temperature yellowing resistance improvement. Effect

Active Publication Date: 2022-04-01
INST OF CHEM ENG GUANGDONG ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But there is no research report on changing the defect in the molecular structure

Method used

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  • A curable organosilicon composition and its preparation method and application
  • A curable organosilicon composition and its preparation method and application
  • A curable organosilicon composition and its preparation method and application

Examples

Experimental program
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preparation example Construction

[0059] For the synthesis process schematic diagram of the raw materials MD type vinyl silicone oil, MT type vinyl silicone resin, D type hydrogen-containing silicone oil and T type hydrogen-containing silicone oil in Examples 1-5, please refer to the attached figure 1 .

[0060] Combine the following figure 1 , indicating that the preparation method of each raw material is as follows:

[0061] 1. Preparation of MD type vinyl silicone oil

[0062] Methylphenyldimethoxysilane, diphenyldimethoxysilane, dimethyldimethoxysilane and tetramethyldivinylsiloxane are mixed in a solvent-free condition according to a certain feed ratio. , drop 1.5wt‰ of KOH aqueous solution (the water content is 1.7mol / mol siloxane), hydrolyze at 72°C for 2h, and distill at 110°C for 5h. After the reaction, remove water and filter to remove the catalyst to obtain MD type vinyl silicone oil.

[0063] 2. MT type vinyl silicone resin

[0064] Mix phenyltrimethoxysilane, methyltrimethoxysilane and tetrame...

Embodiment 1

[0070] Si-Ph and Si-CH 3 MD type vinyl silicone oil with a molar ratio of 1:0.7, no Si-CH 3 Group MT type vinyl silicone resin, Si-Ph and Si-CH 3 D-type hydrogen-containing silicone oil with a molar ratio of 1:1, no Si-CH 3 The T-type hydrogen-containing silicone oil of the group was mixed in a mass ratio of 25:50:19:6, 15 ppm of catalyst was added, mixed evenly, and the silicone composition of this example was obtained by vacuum defoaming.

[0071] Fill the silicone composition of this example into a mold, and cure at 150° C. for 1 hour to obtain a film.

Embodiment 2

[0073] Si-Ph and Si-CH 3 MD type vinyl silicone oil with a molar ratio of 1:1, does not contain Si-CH 3 Group MT type vinyl silicone resin, Si-Ph and Si-CH 3 D-type hydrogen-containing silicone oil with a molar ratio of 1:1, no Si-CH 3 The T-type hydrogen-containing silicone oil of the group was mixed in a mass ratio of 25:50:19:6, 15 ppm of catalyst was added, mixed evenly, and the silicone composition of this example was obtained by vacuum defoaming.

[0074] Fill the silicone composition of this example into a mold, and cure at 150° C. for 1 hour to obtain a film.

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PUM

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Abstract

The invention discloses a curable silicone composition, a preparation method and application thereof. The curable silicone composition comprises the following components in parts by mass: 10-70 parts of linear vinyl silicone oil, 30-90 parts of network vinyl silicone resin, and 15-30 parts of hydrogen-containing silicone oil. The invention is designed from the perspective of molecular structure, which can not only adjust the viscosity of the silicone oil component and facilitate the mixing operation of the silicone composition, but also make the molecules of the composition more tightly combined during curing, effectively increasing the crosslinking density. Without using any additives, the mechanical properties of the sealant made of this organosilicon composition, such as hardness, tensile strength, etc., have been greatly increased, and at the same time, the high temperature yellowing resistance of the material has also been improved. improve.

Description

technical field [0001] The invention relates to the technical field of silicone materials, in particular to a curable silicone composition and its preparation method and application. Background technique [0002] The curable silicone composition undergoes silicon-hydrogen bond addition reaction, and the cured encapsulation glue is used in optical semiconductor devices as a covering layer of semiconductors, which can play a role in bonding them to substrates or frames. The packaging glue used in high-power light-emitting diodes is a high-performance LED silicone packaging glue, which requires high light transmission, high refractive index, aging resistance, yellowing resistance, not easy to break, and various hardness according to requirements, etc. . [0003] At present, the most commonly used high-performance LED encapsulants are silicone compositions containing aryl groups. The introduction of aryl groups can effectively increase the refractive index, and has good radiati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D183/07C09D183/05H01L33/56
CPCC09J183/04H01L33/56C08L2201/08C08L2203/206C08L2205/025C08L2205/03C08L83/04
Inventor 冯璐栾安博邱美坚汤小燕
Owner INST OF CHEM ENG GUANGDONG ACAD OF SCI