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A kind of polyimide and preparation and application, polyimide-epoxy resin interpenetrating network polymer composite material and preparation and application
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A technology of epoxy resin and polyimide, applied in the field of damping materials, can solve the problems that the field of polymer damping materials has not been applied
Active Publication Date: 2021-05-11
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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[0003] MXene is a new type of two-dimensional inorganic compound in materials science reported in 2011. It has been used in gas adsorption, sensors, lithium-ion batteries, capacitors, catalysis, transparent conductive films and hydrogen storage materials, but in the field of polymer damping materials has not been applied
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[0036] The present invention provides the preparation method of polyimide described in above-mentioned technical scheme, comprises the following steps:
[0038] The polyamic acid solution is refluxed to obtain polyimide.
[0039] The present invention combines 4,4'-diamino-2,2'-bistrifluoromethyl biphenyl, 4,4'-diaminodiphenyl ether, organic aprotic solvent and 2,2-bis[4-(3 , 4-dicarboxyphenoxy) phenyl] propane dianhydride mixed for polymerization to obtain a polyamic acid solution. In the present invention, the 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl, 4,4'-diaminodiphenyl ether and 2,2-bis[4-(3, The molar ratio of 4-dicarboxyphenoxy)phenyl]propane dianhydride is preferably (1~3):(1~3):4, more preferably 1:3:4;
[0040]...
Embodiment 1
[0063] 2.5mmol 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl (TFMB) and 7.5mmol 4,4'-diaminodiphenyl ether (ODA) were mixed with 40g N-methylpyrrolidone ( NMP) mixed, stirred at room temperature and under a dry nitrogenatmosphere until completely dissolved, then 10mmol 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride was added in 5 times In the resulting solution, stir at room temperature and under a nitrogenatmosphere for 48h to obtain a polyamic acid solution (solid content is 10%), and the polyamic acid is denoted as PAA-1; 4g toluene is added to the polyamic acid solution at 200 Under the conditions of ℃ and dry nitrogenatmosphere, heat reflux for 6h, then pour the resulting product into industrial ethanol solution to precipitate, wash, filter with suction, and dry in an oven at 200°C for 36h to obtain polyimide PI-1, namely x: y=1:3, (the structure is shown in formula I).
Embodiment 2
[0065] The difference between this example and Example 1 is that the molar ratio of TFMB and ODA is 2:2, that is, 2.5mmol 4,4'-diamino-2,2'-bistrifluoromethylbiphenyl (TFMB) is used and 2.5mmol 4,4'-diaminodiphenyl ether (ODA) to prepare polyimide, that is, x:y=2:2, (the structure is shown in formula I).
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Abstract
The invention provides a polyimide and its preparation and application, a polyimide-epoxy resin interpenetrating network polymercomposite material and its preparation and application, belonging to the technical field of damping materials. ‑CF in the polyimide molecular chain provided by the present invention 3 and ‑O‑groups contribute to the damping behavior of polyimides. In the present invention, Nb 2 C‑MXene and the aforementioned polyimides were used to prepare interpenetrating network polymer composites, due to the Nb 2 F- and OH-groups are attached to the surface of C‑MXene, which can form hydrogen bonds with groups such as ‑OH and ‑NH in the molecular chains of polyimide and epoxy resins to enhance the interfacial bonding strength, and good interfacial bonding Strength can better transfer stress, improve the load-carrying capacity of composite materials, and enhance the internal friction between polymer molecular chains and between polymer molecular chains and MXene particles, thereby improving the damping performance of interpenetrating network polymer composites.
Description
technical field [0001] The invention relates to the technical field of damping materials, in particular to a polyimide and its preparation and application, a polyimide-epoxy resin interpenetrating network polymer composite material and its preparation and application. Background technique [0002] Interpenetrating network polymers (IPNs) are a new class of functional composite materials, which are widely used in damping materials due to their viscoelasticity, wide glass transition temperature region, excellent mechanical and thermal stability, etc. However, existing interpenetrating network polymers (IPNs), such as PU (polyurethane) / PS (polystyrene) and PMMA (polymethyl methacrylate) / PS (polystyrene), etc., usually exhibit two The characteristics of phase incompatibility, the damping curve has two peaks and the peak width is small, and the damping performance is limited, which limits its application in the damping field. Therefore, improving the damping properties of interp...
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