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A preparation device and method for high-purity oxygen-free copper

A preparation device and technology for oxygen-free copper, which are applied in the directions of improving energy efficiency and process efficiency, can solve the problems of small single production volume, high production cost, and high oxygen content in products, and achieve good quality consistency and improved Purity, high purity effect

Active Publication Date: 2022-05-17
厦门埃弗格林科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] For this reason, it is necessary to provide a high-purity oxygen-free copper preparation device and preparation method to solve the problems of small single production volume, high oxygen content in the product and high production cost in the existing high-purity oxygen-free copper preparation technology

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  • A preparation device and method for high-purity oxygen-free copper
  • A preparation device and method for high-purity oxygen-free copper
  • A preparation device and method for high-purity oxygen-free copper

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Embodiment 1

[0041] see Figure 1-3, this embodiment discloses a preparation device for high-purity oxygen-free copper, including a furnace body 1, a graphite crucible 3, a heat insulation cage 8, an induction heating system, a vacuum system 2, a heat dissipation system 9, a protective gas device 5 and secondary feeding Device 4, the induction heating system includes an induction heating coil 7, a water-cooled cable, a frequency conversion cabinet and a water-cooling pipeline, the frequency conversion cabinet is arranged outside the furnace body 1 (not shown in the drawings), and the two ends of the water-cooling cable are connected to the frequency conversion cabinet and the induction heating coil 7 , the water-cooling pipeline communicates with the cooling water channel in the water-cooling cable, the graphite crucible 3, the induction heating coil 7, and the heat insulation cage 8 are all fixed in the furnace body 1, the graphite crucible 3 is located in the heat insulation cage 8, and t...

Embodiment 2

[0050] A preparation method of high-purity oxygen-free copper, comprising the steps of:

[0051] (1) Preload copper material in graphite crucible;

[0052] (2) Close the furnace body, turn on the vacuum system, and the vacuum system will evacuate the furnace body to a vacuum degree of 2X10 -2 Pa and maintained, then the induction heating coil is energized, and the frequency of the induction heating coil is set to be 500Hz to melt the copper material in the graphite crucible;

[0053] (3) Under vacuum environment, the secondary feeding device adds copper material to the graphite crucible for the second time, so that the copper material added for the second time is completely melted, the copper material added for the first time and the copper material added for the second time The mass ratio is 3.5:1;

[0054] (4) After melting, raise the temperature to 1350°C and continue heat preservation and refining for 0.5h, then increase the frequency of the induction heating coil to 150...

Embodiment 3

[0058] A kind of preparation method of high-purity oxygen pure copper, its step is identical with embodiment 2, and difference is that, during smelting, the vacuum degree in furnace remains at 4×10 -2 Pa, the mass ratio of copper material added for the first time and copper material added for the second time is 3:1, the frequency of the induction heating coil during smelting is 550Hz, the heat preservation refining temperature is 1375°C, the heat preservation heating time is 1h, and the frequency of the induction heating coil during crystallization It is 1750Hz, the temperature of secondary heat preservation and refining is 1125°C, the time of secondary heat preservation and refining is 0.75h, the pressure in the furnace is 65000Pa during crystallization, and the total time of crystallization, annealing and cooling is 54h.

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Abstract

The invention relates to the technical field of metallurgical purification of copper, and discloses a high-purity oxygen-free copper preparation device, including a furnace body, a graphite crucible, a heat insulation cage, an induction heating system, a vacuum system, a heat dissipation system, a protective gas device and two Secondary feeding device, induction heating system includes induction heating coil and frequency conversion cabinet, graphite crucible, induction heating coil and heat insulation cage are all fixed in the furnace body, graphite crucible is located in heat insulation cage, induction heating coil is located on the periphery of heat insulation cage, vacuum The system and the protective gas device are all connected to the furnace body, the secondary feeding device is used for secondary feeding to the graphite crucible, and the heat dissipation system is used for the heat dissipation of the crystallization and cooling process of the copper melt in the graphite crucible. The device and method of the present invention solve the current problem. There are problems in the preparation method of high-purity oxygen-free copper, such as small single-batch production volume, high oxygen content in the product, and high process production cost.

Description

technical field [0001] The invention relates to the technical field of metallurgical purification of copper, in particular to a preparation device and method for high-purity oxygen-free copper. Background technique [0002] High-purity copper is generally made of electrolytic cathode copper as raw material, and then purified by multiple electrolysis methods, ion exchange methods, zone melting methods, vacuum combined directional solidification, electron beam combined directional solidification, etc., electrolytic refining and ion exchange processes Complexity, unstable quality, high pressure on environmental protection; zone melting refining method has high energy consumption, less single charge, low production efficiency and high cost; electron beam combined with directional solidification method, expensive equipment and high investment cost. The vacuum combined with directional solidification method, the current technology, generally puts the copper material into the graph...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22B15/00
CPCC22B15/006Y02P10/25
Inventor 杨继荣
Owner 厦门埃弗格林科技有限公司
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