Nitrogen-containing compounds, electronic components and electronic devices
A nitrogen compound, electronic component technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of only tens of hours of colorization, performance does not meet commercialization requirements, etc., achieve good hole transport characteristics, high Electron tolerance and film-forming properties, effect of large space volume
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Embodiment 1
[0247] Embodiment 1: green organic electroluminescent device
[0248] The anode was prepared by the following process: the thickness of ITO was The substrate (manufactured by Corning) was cut into a size of 40mm × 40mm × 0.7mm, and it was prepared into an experimental substrate with cathode, anode and insulating layer patterns by using a photolithography process, using ultraviolet ozone and O 2 :N 2 Plasma surface treatment was performed to increase the work function of the anode (experimental substrate) and to remove scum.
[0249] F4-TCNQ was vacuum evaporated on the experimental substrate (anode) to form a thickness of The hole injection layer (HIL), and NPB is evaporated on the hole injection layer to form a thickness of hole transport layer.
[0250] Compound 1 was vacuum evaporated on the hole transport layer to form a thickness of electron blocking layer.
[0251] On the electron blocking layer, GH-n1:GH-n2:Ir(ppy) 3 Carry out co-evaporation with the ratio of...
Embodiment 2-33
[0255] An organic electroluminescent device was produced in the same manner as in Example 1 except that compounds shown in Table 11 below were used instead of Compound 1 when forming the electron blocking layer.
Embodiment 34
[0276] Example 34: Blue organic electroluminescence device
[0277] The anode was prepared by the following process: the thickness was The ITO substrate (manufactured by Corning) was cut into a size of 40mm × 40mm × 0.7mm, and it was prepared into an experimental substrate with cathode, anode and insulating layer patterns by using a photolithography process, using ultraviolet ozone and O 2 :N 2 Plasma surface treatment was performed to increase the work function of the anode (experimental substrate) and to remove scum.
[0278] F4-TCNQ was vacuum evaporated on the experimental substrate (anode) to form a thickness of The hole injection layer (HIL), and the compound NPB is vacuum-evaporated on the hole injection layer to form a thickness of hole transport layer (HTL).
[0279] Compound 6 was vapor-deposited on the HTL as an electron blocking layer (EBL) with a thickness of
[0280] On the EBL, the compound α,β-ADN is used as the main body, and BD-1 is doped at the sam...
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