Manufacturing method of ultrathin heat-conducting patch and ultrathin heat-conducting patch

Abstract

The invention discloses a manufacturing method of an ultrathin heat-conducting patch and the ultrathin heat-conducting patch. The structure manufacturing of the ultrathin heat-conducting patch is achieved through a 3D printing technology. The ultrathin heat-conducting patch specifically comprises a base plate, an upper plate, capillary pore layers, condensation structures and the like. The ultrathin heat-conducting patch is manufactured before vacuumizing and liquid injection processes, is integrally formed in a 3D printing mode, and is firm and durable; meanwhile, ultrathin size manufacturingcan be achieved through the 3D printing technology; the condensation structures of the base plate and the upper plate are correspondingly arranged and pressed against each other in pairs, so that deformation of the heat-conducting patch is avoided; the state change speed of working liquid making contact with the capillary pore layers can be increased through manufacturing of the capillary pore layers of the base plate and the upper plate; and the thermal resistance of the ultrathin heat-conducting patch is lowered, and the heat dissipation efficiency is improved, so that the service life of electronic equipment is guaranteed.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a method for manufacturing an ultra-thin heat-conducting patch and the ultra-thin heat-conducting patch. Background technique [0002] With the rapid development of electronic integration technology, electronic equipment is developing in the direction of miniaturization and thinning, and the integration level of the system is getting higher and higher. On the other hand, the application of high-power components in electronic equipment increases the thermal power consumption sharply, and the resulting heat does not have enough space to dissipate, which directly affects the working performance and service life of the product. Statistics show that it is about 40%. This is due to the fact that the thickness of electronic equipment is getting thinner and thinner, and the power consumption and heat generation are also increasing. The traditional heat sink has a larger structur...

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Problems solved by technology

[0003] Due to the limited internal space of electronic products and the substantial increase in heat flux, traditional heat dissipation devices have been difficult to effectively solve their heat dissipation problems

With the development of demand, some advanced heat dissipation technologies have appeared on the market, one of which has a strong competitiveness in heat conduction and heat dissipation solutions, such as ultra-thin heat conduction patch, the existing ultra-thin heat conduction patch has two upper and lower cover plates In the process of truncation and sealing welding, it is easy to be damaged or broken, which will increase the probability of fluid leakage in the cavity. The heat dissipation performance of the existing ultra-thin thermal pads is often weak. The traditional structural design Does not have a capillary structure Small pores and high density affect the diffusion of liquid working fluid, resulting in uneven distribution of the working fluid, and the small capillary force affects the circulation speed of the working fluid, making the surface heat transfer capacity of the ultra-thin thermal pad poor. , thereby affecting the service life of electronic equipment

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