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A kind of high thermal expansion glass powder for copper paste and its preparation method and application

A high thermal expansion, glass powder technology, used in the field of conductive fillers, can solve problems such as inability to apply, and achieve the effects of short grinding time, easy availability of raw materials, and uniform particle size distribution.

Active Publication Date: 2022-05-03
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of glass for electronic paste is mostly used in the sealing of ceramic capacitors with small thermal expansion coefficients such as alumina, but it cannot be applied to magnesia ceramic substrates with high thermal expansion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A high thermal expansion glass powder for copper paste is provided, the components are BaO 55%, ZnO 19.5%, B 2 o 3 8%, Al 2 o 3 8%, CaO 5%, Fe 2 o 3 0.5%, SiO 2 1%, SrO 0.5%, SnO 2 1%, CoO0.5%, ZrO 2 0.5%, Bi 2 o 3 0.5%.

[0025] The preparation method of high thermal expansion glass powder for above-mentioned copper paste specifically comprises the following steps:

[0026] 1) According to the ratio of each oxide component in the above-mentioned glass powder, weigh 70.8g BaCO with an electronic balance 3 , 19.5g ZnO, 14.2g H 3 BO 3 , 8g Al 2 o 3 , 8.9g CaCO 3 , 0.5g Fe 2 o 3 , 1g SiO 2 , 0.7g SrCO 3 , 1.6g Sn(CO 3 ) 2 , 0.5g CoO, 0.5g ZrO 2 , 0.5g Bi 2 o 3 ; Put the weighed raw materials into a ball mill and grind and stir for 10 minutes until the glass raw materials are evenly mixed.

[0027] 2) Put the glass raw materials uniformly mixed in step 1) into a corundum crucible, raise the temperature to 1280°C at a rate of 10°C / min in a hig...

Embodiment 2

[0031] A high thermal expansion glass powder for copper paste is provided, the components are: BaO 52%, ZnO20.3%, B 2 o 3 9%, Al 2 o 3 7%, CaO 5%, Fe 2 o 3 0.5%, SiO 2 2%, SrO 2%, SnO 20.5%, CoO0.5%, ZrO 2 0.5%, Bi 2 o 3 0.7%.

[0032] The preparation method of high thermal expansion glass powder for above-mentioned copper paste specifically comprises the following steps:

[0033] 1) According to the distribution ratio of each oxide component in the above-mentioned glass powder, weigh 67g of BaCO with an electronic balance 3 , 20.3gZnO, 15.98gH 3 BO 3 , 7g Al 2 o 3 , 8.9g CaCO 3 , 0.5g Fe 2 o 3 , 2g SiO 2 , 2.85g SrCO 3 , 0.8g Sn(CO 3 ) 2 , 0.5g CoO, 0.5g ZrO 2 , 0.7g Bi 2 o 3 ; Put the weighed raw materials into a ball mill and grind and stir for 10 minutes until they are evenly mixed.

[0034] 2) Put the glass raw materials uniformly mixed in step 1) into an alumina crucible, raise the temperature to 1300° C. at a heating rate of 12° C. / min in ...

Embodiment 3

[0038] A high thermal expansion glass powder for copper paste is provided, the components are: BaO 60%, ZnO21.1%, B 2 o 3 8%, Al 2 o 3 4%, CaO 2.5%, Fe 2 o 3 0.5%, SiO 2 1%, SrO 0.5%, SnO 2 0.5%, CoO 0.5%, ZrO 2 0.5%, Bi 2 o 3 0.9%.

[0039] The preparation method of high thermal expansion glass powder for above-mentioned copper paste specifically comprises the following steps:

[0040] 1) According to the distribution ratio of each oxide component in the above-mentioned glass powder, weigh 77.3g of BaCO with an electronic balance 3 , 21.1g ZnO, 14.2g H 3 BO 3 , 7g Al 2 o 3 , 4.5g CaCO 3 , 0.5g Fe 2 o 3 , 1g SiO 2 , 0.7g SrCO 3 , 0.8g Sn(CO 3 ) 2 , 0.5g CoO, 0.5g ZrO 2 , 0.9g Bi 2 o 3 ; Put the weighed raw materials into a ball mill and grind and stir for 10 minutes until they are evenly mixed.

[0041] 2) Put the glass raw materials uniformly mixed in step 1) into an alumina crucible, raise the temperature up to 1350° C. at a rate of 14° C. / min...

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Abstract

The invention discloses a high thermal expansion glass powder for copper slurry and its preparation method and application. It comprises the following components in terms of mass percentage: BaO 52-62%, ZnO 19-25%, B 2 o 3 8~10%, Al 2 o 3 4~8%, CaO 2.5~5%, Fe 2 o 3 0.1~3%, SiO 2 1~3%, SrO 0.1~3%, SnO 2 0.1-5%, CoO 0.1-3%, ZrO 2 0.1~3%, Bi 2 o 3 0.5~1%. Its preparation: mix raw materials uniformly to obtain glass batch material, spread it on the mold after melting, cool naturally under air condition, then pulverize, ball mill, and sieve to obtain high thermal expansion glass powder for copper paste. The glass powder has low sintering temperature, high thermal expansion coefficient and good dielectric constant, can be applied to the sealing of magnesia ceramic substrates, has simple preparation method, and cheap and easy-to-obtain raw materials.

Description

technical field [0001] The invention relates to the technical field of conductive fillers, in particular to a high thermal expansion glass powder for copper paste and its preparation method and application. Background technique [0002] With the development of the electronics industry, high-quality, high-efficiency electronic components are becoming more and more important. As a sealing material for the manufacture of electronic components, electronic paste has important applications in many aspects, including the manufacture of capacitors, integrated circuits, resistors, sensitive components and so on. The main application fields of these electronic components are military, mobile phones, computers, digital home appliances and other electronic products. Therefore, in the electronic information industry, the demand for electronic paste is increasing, and the requirements are getting higher and higher. According to the conductive phase, the electronic paste is mainly divide...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C12/00C03C3/066C04B37/00
CPCC03C12/00C03C3/066C04B37/003
Inventor 何峰闫东阳张兵杨虎谢峻林
Owner WUHAN UNIV OF TECH