Semiconductor chip processing and slitting equipment
A semiconductor and chip technology, applied in the field of semiconductor chip processing and slitting equipment, can solve the problems of filter screen blockage, fine block grinding, inconvenience, etc., and achieve the effect of improving work efficiency, avoiding blockage and better filtering effect.
Inactive Publication Date: 2021-01-15
庄绍海
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Problems solved by technology
[0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a semiconductor chip processing and cutting equipment to solve the problem that during the filtering process, the silicon blocks will cause the filter screen to be clogged, and the fine blocks need to be processed twice during recycling. Grinding is very inconvenient
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[0026] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0027] see Figure 1 to Figure 7 , the present invention provides a technical solution for semiconductor chip processing and cutting equipment: its structure includes: a filter 1, a body 2, a controller 3, a cutting device 4, and a radiator 5, and the filter 1 is fixed on the body 2 by bolts In the middle part of the body, the left side of the body 2 extends upwards with a controller 3, the controller 3 is connected to the motor at the inner end of the cutting device 4 through a wire, and the cutting device 4 is horizontally fixed on the radiator 5 bottom.
[0028] The filter 1 is composed of a material distribution middle hopper 11, a baffle plate 12, a collecting hopper 13, a powder suction chamber 14, a material collection bottom groove 15, an...
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The invention discloses semiconductor chip processing and slitting equipment. The semiconductor chip processing and slitting equipment structurally comprises a filter, a machine body, a controller, aslitting device and a radiator, wherein the filter is fixed in the middle of the machine body through bolts, a through hole in the left side of the machine body extends upwards and is provided with the controller, the controller is connected with a motor at the inner end of the slitting device through a wire, and the slitting device is horizontally fixed at the bottom of the radiator. The semiconductor chip processing and slitting equipment has the beneficial effects that a baffle and a blocking strip are matched in a bidirectional mode, so that when a screening hopper rotates, silicon particles collide with the baffle and fall off, under the condition that the silicon particles collide with the baffle and still do not fall off, the blocking strip on the surface of a vibration cavity on the outer side is extruded in the reverse direction, fragments are gradually guided to be discharged to the bottom, so that a screen is prevented from being blocked, and the filtering effect is better.
Description
technical field [0001] The invention relates to semiconductor chip processing and cutting equipment, which belongs to the field of semiconductor cutting devices. Background technique [0002] Etching and wiring are carried out on the semiconductor sheet to make a semiconductor device that can realize a certain function. Not only silicon chips, but also semiconductor materials such as gallium arsenide and germanium are common. Semiconductor chips need to be cut and polished in the early stage of processing. When cutting, high-grade steel wires are equidistantly distributed and cut with semiconductor chip raw materials at high speed. However, due to When cutting, the silicon wafer is divided by the friction between the steel wire and the silicon wafer. During the cutting process, a large amount of silicon powder will be produced, as well as small fragments caused by the collision of the steel wire during grinding. Therefore, in the process of filtering In the process, the sil...
Claims
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IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/04B28D5/0058B28D5/0076
Inventor 庄绍海
Owner 庄绍海