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Tin-based solder and preparation method thereof

A solder and tin-based technology, applied in the field of tin-based solder and its preparation, can solve problems such as cracking and solder joint failure, and achieve the effects of avoiding coarsening, preventing solder joint cracks, and reducing surface tension

Active Publication Date: 2021-02-09
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the service process of the solder joint, the intrinsically brittle intermetallic compound at the interface between the solder and the substrate grows excessively, and the solder joint cracks along the interface when it is subjected to vibration, mechanical shock, etc., resulting in the failure of the solder joint

Method used

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  • Tin-based solder and preparation method thereof
  • Tin-based solder and preparation method thereof
  • Tin-based solder and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0028] A kind of tin-based solder provided by the present invention comprises Sn, Zn, Bi, Ag and Sb, and the mass percent of each component is respectively Zn: 9.0%, Bi: 2.0%, Ag: 1.0%, Sb: 1.0%, surplus is Sn.

[0029] The preparation method of described tin-based solder comprises the following steps:

[0030] (1) Weigh the pure metal raw materials Sn and Ag according to the mass ratio of 1:1, adopt vacuum induction melting, the melting temperature is 900°C, and the vacuum degree is 10 -3 Pa, the smelting time is 2 hours, the electromagnetic stirring effect ensures that the alloy composition is uniform, and the Sn-Ag master alloy is prepared.

[0031] (2) According to the design composition of Sn-based lead-free solder, weigh the Sn-Ag master alloy prepared in step (1) and the raw materials Sn, Zn, Bi, Sb, put them into a glass test tube for vacuum packaging, and the vacuum degree is 10 -4 Pa, put the glass tube with raw materials into a 16-channel heat treatment furnace wi...

Embodiment 2

[0035] A kind of tin base solder that the present invention provides comprises Sn, Zn, Bi, Ag and Sb, and each component mass percent is Zn: 9.0%, Bi: 2.0%, Ag: 1.0%, Sb: 2.0%, balance is Sn.

[0036] The preparation method of described tin-based solder comprises the following steps:

[0037] (1) Weigh the pure metal raw materials Sn and Ag according to the mass ratio of 1:1, adopt vacuum induction melting, the melting temperature is 900°C, and the vacuum degree is 10 -3 Pa, the smelting time is 2 hours, the electromagnetic stirring effect ensures that the alloy composition is uniform, and the Sn-Ag master alloy is prepared.

[0038] (2) According to the design composition of Sn-based lead-free solder, weigh the Sn-Ag master alloy prepared in step (1) and the raw materials Sn, Zn, Bi, Sb, put them into a glass test tube for vacuum packaging, and the vacuum degree is 10 -4Pa, put the glass tube with raw materials into a 16-channel heat treatment furnace with swing function, t...

Embodiment 3

[0042] A kind of tin-based solder provided by the present invention comprises Sn, Zn, Bi, Ag and Sb, and the mass percent of each component is respectively Zn: 9.0%, Bi: 2.0%, Ag: 2.0%, Sb: 1.0%, surplus is Sn.

[0043] The preparation method of described tin-based solder comprises the following steps:

[0044] (1) Weigh the pure metal raw materials Sn and Ag according to the mass ratio of 1:1, adopt vacuum induction melting, the melting temperature is 900°C, and the vacuum degree is 10 -3 Pa, the smelting time is 2 hours, the electromagnetic stirring effect ensures that the alloy composition is uniform, and the Sn-Ag master alloy is prepared.

[0045] (2) According to the design composition of Sn-based lead-free solder, weigh the Sn-Ag master alloy prepared in step (1) and the raw materials Sn, Zn, Bi, Sb, put them into a glass test tube for vacuum packaging, and the vacuum degree is 10 -4 Pa, put the glass tube with raw materials into a 16-channel heat treatment furnace wi...

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Abstract

The invention discloses tin-based solder and a preparation method thereof, and belongs to the technical field of electronic materials and electronic preparation. The tin-based solder comprises the following components in percentage by mass: 9.0 percent of Zn, 2.0 percent of Bi, 1.0 percent to 2.0 percent of Ag, 1.0 percent to 2.0 percent of Sb, and the balance Sn. The novel tin-based lead-free solder provided by the invention can replace traditional tin-lead solder, and has the advantages of lower melting point, favorable wettability, favorable mechanical strength, favorable thermal fatigue property, high bonding strength and high weldability. According to the tin-based solder and the preparation method thereof provided by the invention, an Sn-Ag intermediate alloy is prepared preferentially, and then the required alloy elements are proportioned according to requirements, packaged into a glass test tube in a vacuum mode and smelted to prepare the Sn-based novel lead-free solder, so that that microalloy elements can be ensured to be added into solder alloy more evenly, and accurate control over components and a good microstructure can be guaranteed; and the finally obtained solder is high in bonding strength and high in reliability.

Description

technical field [0001] The invention relates to a tin-based solder and a preparation method thereof, belonging to the technical field of tin-based lead-free solder. Background technique [0002] With the enhancement of people's awareness of environmental protection and the continuous improvement of microelectronic packaging technology, the size of solder joints is also becoming smaller. Solder joints need to bear heavy electrical, mechanical, and thermal loads, which poses new challenges to the development of new tin-based solders with high reliability and durability. The traditional Sn-Pb solder is widely used in the modern electronic packaging industry because of its low melting point, good plasticity, good wettability to Cu and some other alloys, and low cost. However, Pb and its compounds are toxic, pollute soil and water sources, and seriously affect the growth and development of organisms and the environment. Therefore, Pb in Sn-Pb solder should be removed or replace...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/03C22C13/00B23K35/26
CPCC22C1/03C22C13/00B23K35/262
Inventor 李才巨彭言之杨娇娇周广吉易健宏高鹏宋鹏溥存继
Owner KUNMING UNIV OF SCI & TECH
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