Supercharge Your Innovation With Domain-Expert AI Agents!

Electronic skin and preparation method thereof

A technology of electronic skin and conductive layer, which is applied in the field of electronic skin and its preparation, can solve the problems of unsuitable for industrial use, poor electrical conductivity of electronic skin, complicated production, etc., achieve uniform contact range, good heat dissipation, and increase high temperature resistance Effect

Inactive Publication Date: 2021-02-12
临沂京瑞新材料科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing electronic skin has poor electrical conductivity, is complicated to manufacture, and is not wear-resistant, so it is not suitable for industrial use

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic skin and preparation method thereof
  • Electronic skin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0030] The present invention provides an electronic skin, comprising a base layer 1, a sensing layer 2 disposed on the base layer 1, an encapsulation layer 3 disposed on the sensing layer 2, and a glue layer disposed at the bottom of the base layer 1. layer 4 and a release paper 5 arranged on the glued layer 4 . The base layer 1 and the packaging layer 3 are respectively provided with a heat dissipation layer 6; the induction layer 2 is provided with a conductive layer 7 and a micro sensor 8; the base layer 1 is made of polyimide, polyvinylidene fluoride, poly Made of aramid and epoxy resin raw materials; the sensing layer 2 is made of graphene fibers, basalt fibers and silicon rubber raw materials; the encapsulation layer 3 is made of epoxy resin and polyurethane resin raw materials; the The heat dissipation layer 6 is coated with heat dissipation silica gel on the base layer 1 and the encapsulation layer 3; the conductive layer 7 is formed by connecting conductive metal line...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of electronic skin, in particular to electronic skin and a preparation method thereof. The electronic skin comprises a substrate layer, an induction layerarranged on the substrate layer, a packaging layer arranged on the induction layer, a gluing layer arranged at the bottom of the substrate layer and release paper arranged on the gluing layer. The substrate layer and the packaging layer are respectively provided with a heat dissipation layer. A conductive layer and a micro sensor are arranged on the induction layer; the substrate layer is preparedfrom polyimide, polyvinylidene fluoride, aromatic polyamide and epoxy resin raw materials; the induction layer is made of graphene fibers, basalt fibers and silicone rubber raw materials; the packaging layer is made of epoxy resin and polyurethane resin raw materials. The conductivity of the electronic skin is improved, and the wear resistance is improved.

Description

technical field [0001] The invention relates to the technical field of electronic skin, in particular to an electronic skin and a preparation method thereof. Background technique [0002] Electronic skin has great application prospects in the fields of intelligent robots, bionic prostheses, and real-time health monitoring. Electronic skin is used to imitate the sensory functions of skin such as touch, temperature perception and other functions. It has a simple structure, can be processed into various shapes, can be attached to the surface of the device, and can allow the device to perceive information such as the location, orientation and hardness of the object. The existing electronic skin has poor conductivity, is complicated to manufacture, and is not wear-resistant, so it is not suitable for industrial use. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an electronic skin and a preparation method thereof t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C08L79/08C08L27/16C08L77/10C08L63/00C08J5/18C08L83/04C08K7/06C08K7/10C08K3/08C09D163/00C09D175/04G01D5/12
CPCC09J7/29C08J5/18C09D163/00C09D175/04G01D5/12C09J2479/086C09J2427/006C09J2477/006C09J2463/006C09J2483/006C09J2475/006C08J2379/08C08J2327/16C08J2377/10C08J2363/00C08J2479/08C08J2427/16C08J2477/10C08J2463/00C08J2383/04C08K7/06C08K7/10C08K3/08C08L75/04C08L63/00
Inventor 姜志国李文杰
Owner 临沂京瑞新材料科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com