Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A process for preparing high-density tungsten-copper alloy metal material by using tungsten powder

A technology of tungsten-copper alloy and metal materials, which is applied in the direction of metal material coating technology, metal processing equipment, liquid chemical plating, etc., can solve the problems of low densification and difficult sintering of tungsten-copper alloys, and achieve uniform distribution of components, Good high temperature oxidation resistance and ablation resistance, the effect of improving the overall performance

Active Publication Date: 2021-11-02
SHAANXI SIRUI ADVANCED MATERIALS CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention solves the shortcomings of difficult sintering and low densification of tungsten-copper alloy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A process for preparing a high-density tungsten-copper alloy metal material by using tungsten powder, comprising the following steps:

[0033] (1) Disperse the tungsten powder into the copper plating solution, and pre-plate copper by electroless plating; then transfer the tungsten powder after pre-copper plating to CuSO 4 Copper electroplating is carried out in acidic electroplating solution, and post-treatment is carried out after electroplating to obtain copper-clad tungsten composite powder;

[0034] The particle size of the tungsten powder is 8μm, and the tungsten powder is ball milled for 0.5h before electroless copper plating, so that the agglomerated tungsten powder is fully dispersed;

[0035] Pre-plating copper by electroless plating: adjust the pH value to 14, the temperature is 40°C, and the pre-plating time is 40 minutes; the pre-plating solution used includes CuSO 4 , reducing agent, chelating dispersant, stabilizer, surfactant, promotor, acid-base reconci...

Embodiment 2

[0046] A process for preparing a high-density tungsten-copper alloy metal material by using tungsten powder, comprising the following steps:

[0047] (1) Disperse the tungsten powder into the copper plating solution, and pre-plate copper by electroless plating; then transfer the tungsten powder after pre-copper plating to CuSO 4 Copper electroplating is carried out in acidic electroplating solution, and post-treatment is carried out after electroplating to obtain copper-clad tungsten composite powder;

[0048] The particle size of the tungsten powder is 1 μm, and the tungsten powder is ball-milled for 2 hours before electroless copper plating, so that the agglomerated tungsten powder is fully dispersed;

[0049] Pre-plating copper by electroless plating: adjust the pH value to 10, the temperature is 60°C, and the pre-plating time is 20 minutes; the pre-plating solution used includes CuSO 4 , reducing agent, chelating dispersant, stabilizer, surfactant, promotor, acid-base rec...

Embodiment 3

[0059] A process for preparing a high-density tungsten-copper alloy metal material by using tungsten powder, comprising the following steps:

[0060] (1) Disperse the tungsten powder into the copper plating solution, and pre-plate copper by electroless plating; then transfer the tungsten powder after pre-copper plating to CuSO 4 Copper electroplating is carried out in acidic electroplating solution, and post-treatment is carried out after electroplating to obtain copper-clad tungsten composite powder;

[0061] The particle size of the tungsten powder is 5 μm, and the tungsten powder is ball-milled for 1 hour before electroless copper plating, so that the agglomerated tungsten powder is fully dispersed;

[0062] Pre-plating copper by electroless plating: adjust the pH value to 12, the temperature is 50°C, and the pre-plating time is 30 minutes; the pre-plating solution used includes CuSO 4 , reducing agent, chelating dispersing agent, stabilizer, surfactant, promotor, acid-bas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

A process for preparing high-density tungsten-copper alloy metal materials using tungsten powder, comprising the following steps: (1) dispersing tungsten powder into a copper plating solution, and pre-plating copper by electroless plating; then pre-plating tungsten powder transferred to CuSO 4 Carry out electroplating copper in the acidic electroplating solution, carry out after-treatment after electroplating, obtain copper clad tungsten composite powder; Vacuum and pressurize to obtain a sintered body; (3) refire the sintered body in step (2) by hot isostatic pressing to finally obtain a high-density tungsten-copper alloy with a density > 99.5%. The invention solves the shortcomings of difficult sintering and low densification degree of the tungsten-copper alloy.

Description

technical field [0001] The invention relates to the technical field of powder preparation of alloy metal materials, in particular to a process for preparing high-density tungsten-copper alloy metal materials by using tungsten powder. Background technique [0002] Tungsten-copper alloy combines the advantages of metal tungsten and copper. Among them, tungsten has the characteristics of high melting point, high arc ablation resistance, high strength and low thermal expansion coefficient. Copper has high electrical conductivity and high thermal conductivity, so it is widely used in medium and high voltage switch contacts. Head materials, military high temperature resistant materials, electrical machining electrodes, electronic packaging materials and heat sink materials. [0003] Tungsten copper electronic packaging material is a two-phase pseudo-alloy composed of low thermal expansion tungsten and high electrical and thermal conductivity copper. Its thermal expansion coefficie...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/04C22C27/04B22F1/02B22F3/105B22F3/15C23C18/40C25D3/38
CPCC22C1/045C22C27/04B22F3/105B22F3/15C23C18/405C23C18/1637C23C18/1653C25D3/38B22F2998/10B22F1/17
Inventor 周兴王小军周宁赵俊
Owner SHAANXI SIRUI ADVANCED MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com