Cu-Hf-Si-Ni-Ce copper alloy material and preparation method thereof

A cu-hf-si-ni-ce, copper alloy technology, applied in the field of Cu-Hf-Si-Ni-Ce copper alloy material and its preparation, can solve the problem of decreased alloy strength, easy coarsening, alloy conductivity and Intensity reduction and other problems can be achieved to reduce hot-rolled cracking, improve mechanical properties, and improve electrical conductivity.

Active Publication Date: 2021-02-12
FUZHOU UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the control of the amount of P addition is relatively strict. If the amount of P addition is too high, the formed Fe 2 P precipitated particles are easy to coarsen during the aging process, resulting in a decrease in the strength of the alloy; if the amount of P added is too small, it will not be able to form enough Fe with Fe. 2 P precipitates, leading to a decrease in the electrical conductivity and strength of the alloy

Method used

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  • Cu-Hf-Si-Ni-Ce copper alloy material and preparation method thereof
  • Cu-Hf-Si-Ni-Ce copper alloy material and preparation method thereof
  • Cu-Hf-Si-Ni-Ce copper alloy material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031]The mass percentage of the alloy composition is: 0.80wt% Hf, 0.09wt% Si, 0.09wt% Ni, 0.06wt% Ce, the rest is Cu, and the molar ratio of Hf:Si is 1.40:1.

[0032] Its preparation method is:

[0033] (1) Alloy melting and casting: put the raw materials into the crucible of the induction furnace, and evacuate to 10 -3 Pa, then pass through 1.1×10 5 Pa pure argon (Ar ≥ 99.99%) is smelted under the protection of pure argon. After the solid is completely melted to form an alloy melt, keep it for 10 minutes, insert the electrode of the pulse electric field under the melt surface, and the pulse time 150s, pulse frequency 8Hz, pulse current density 7A / mm 2 , the pulse width is 100μs, and then the alloy melt is cast into a graphite mold, and after cooling, the mold is opened to take out the alloy ingot. , Cu-Ce master alloy containing 25wt%Ce;

[0034] (2) Homogenization treatment: Under the protection of pure argon, put the obtained alloy ingot into a heat treatment furnace f...

Embodiment 2

[0044] The mass percentage of the alloy composition is: 0.90wt% Hf, 0.10wt% Si, 0.095wt% Ni, 0.08wt% Ce, the rest is Cu, and the molar ratio of Hf:Si is 1.42:1.

[0045] Its preparation method is:

[0046] (1) Alloy melting and casting: put the raw materials into the crucible of the induction furnace, and evacuate to 10 -3 Pa, then pass through 1.1×10 5 Pa pure argon (Ar ≥ 99.99%) is smelted under the protection of pure argon. After the solid is completely melted to form an alloy melt, keep it for 10 minutes, insert the electrode of the pulse electric field under the melt surface, and the pulse time 90s, pulse frequency 9Hz, pulse current density 10A / mm 2 , the pulse width is 70μs, and then the alloy melt is cast into a graphite mold. After cooling, the mold is opened to take out the alloy ingot. The thickness of the ingot is 25mm; the smelting uses Cu, Hf, Si, Ni metal blocks with a purity ≥ 99.9wt%. , Cu-Ce master alloy containing 25wt%Ce;

[0047] (2) Homogenization tre...

Embodiment 3

[0055] The mass percentage of the alloy composition is: 0.75wt% Hf, 0.06wt% Si, 0.08wt% Ni, 0.05wt% Ce, the rest is Cu, and the molar ratio of Hf:Si is 1.97:1.

[0056] Its preparation method is:

[0057] (1) Alloy melting and casting: put the raw materials into the crucible of the induction furnace, and evacuate to 10 -3 Pa, then pass through 1.1×10 5 Pa pure argon (Ar ≥ 99.99%) is smelted under the protection of pure argon. After the solid is completely melted to form an alloy melt, keep it for 10 minutes, insert the electrode of the pulse electric field under the melt surface, and the pulse time 30s, pulse frequency 5Hz, pulse current density 5A / mm 2 , the pulse width is 50μs, and then the alloy melt is cast into a graphite mold, and after cooling, the mold is opened to take out the alloy ingot. , Cu-Ce master alloy containing 25wt%Ce;

[0058] (2) Homogenization treatment: Under the protection of pure argon, put the obtained alloy ingot into a heat treatment furnace fo...

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Abstract

The invention discloses a Cu-Hf-Si-Ni-Ce copper alloy material and a preparation method thereof. The copper alloy material is composed of Cu, 0.75-1.15 wt% of Hf, 0.06-0.18 wt% of Si, 0.08-0.12 wt% ofNi, and 0.05-0.10 wt% of Ce. The preparation method of the copper alloy material comprises the steps of pulsed electric field casting, homogenization treatment, hot rolling, room-temperature rollingand aging treatment. The components of the copper alloy material do not contain toxic elements; toxic substances are not generated in the preparation process; the harm of the components to the human body and the environment is small; and the prepared copper alloy material is excellent in comprehensive performances such as hardness, strength, electric conductivity and softening resistance and can be used for developing and producing high-performance electronic equipment, various electronic elements, devices, instruments and meters and the like.

Description

technical field [0001] The invention belongs to the technical field of copper alloy materials, and in particular relates to a Cu-Hf-Si-Ni-Ce copper alloy material and a preparation method thereof. Background technique [0002] As the core of modern electronic information technology, the integrated circuit has developed rapidly since its invention in the 20th century. An integrated circuit is packaged by an IC chip and a lead frame, in which the lead frame plays a role in supporting the chip, connecting external circuits, and assisting in heat dissipation during work. With the continuous development of large-scale and ultra-large-scale integrated circuits, higher and higher requirements are put forward for the electrical conductivity, mechanical properties, and softening resistance of lead frame materials. [0003] Although pure copper has good electrical and thermal conductivity, its hardness and strength are low, and it cannot provide sufficient mechanical support under th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/03C22F1/08
CPCC22C1/03C22C9/00C22F1/08
Inventor 王晨张玉业周建辉童长青杨海特曾佳伟苏龙水
Owner FUZHOU UNIV
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