Wafer anti-sticking device
An anti-sticking, wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as shadow effect, clamp ring wafer sticking, etc.
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[0017]SeeFigure 1-4As shown, the present invention provides a technical solution for a wafer anti-sticking device: it includes a protective cover 1, the bottom wall of the protective cover 1 is arranged in a through shape, the bottom of the protective cover 1 is provided with a lifting component, and the top of the lifting component is provided with a top shield The board 11, specifically, the top shielding board 11 is used to provide a shielding function for the lower clamping ring and prevent the wafer clamping contact 121 between the lower edge clamping ring 122 and the edge of the wafer 2 from being deposited during the deposition process. The shielding plate 11 fits with the bottom of the protective cover 1, and the top inner wall of the top shielding plate 11 is provided with a lower clamping ring 12, and the upper inner wall of the lower clamping ring 12 is provided with a wafer clamping contact point 121, and the wafer clamping contact The point 121 is used to c...
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