Semiconductor package for high-speed data transmission and manufacturing method thereof

Abstract

A semiconductor structure and a method of forming the same are provided. A method of manufacturing the semiconductor structure includes: providing a substrate; depositing a first dielectric layer overthe substrate; attaching a waveguide to the first dielectric layer; depositing a second dielectric layer to laterally surround the waveguide; and forming a first conductive member and a second conductive member over the second dielectric layer and the waveguide, wherein the first conductive member and the second conductive member are in contact with the waveguide. The waveguide is configured to transmit an electromagnetic signal between the first conductive member and the second conductive member.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor package for high-speed data transmission and a manufacturing method thereof. Background technique [0002] Electronic equipment using semiconductor devices is essential to many modern applications. As electronic technology advances, semiconductor devices continue to shrink in size while having greater functionality and more integrated circuits. Due to the miniaturization scale of semiconductor devices, chip-on-wafer-on-substrate (CoWoS) is widely used to integrate several chips into a single semiconductor device through through-substrate vias (TSVs). During CoWoS operation, many chips are assembled on a single semiconductor device. Furthermore, many manufacturing operations are performed within a small semiconductor device. [0003] However, the manufacturing operations of semiconductor devices involve many steps and operations on small and thin semiconductor devices. The manufacture of...

AI Technical Summary

Problems solved by technology

Manufacturing of semiconductor devices at miniaturized scales becomes more complicated

Increased complexity in manufacturing semiconductor devices can cause defects such as poor structural configuration and component delamination resulting in significant yield loss and increased manufacturing costs of semiconductor devices

Thus, there are many challenges in modifying the structure of semiconductor devices and improving manufacturing operations

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