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Wafer processing method

A processing method and wafer technology, applied in metal processing equipment, film/sheet adhesive, manufacturing tools, etc., can solve the problem of device chip quality degradation and other issues

Pending Publication Date: 2021-03-12
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the degradation of the quality of the device chip becomes a problem

Method used

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Embodiment Construction

[0037] An embodiment of one embodiment of the present invention will be described with reference to the drawings. First, a wafer processed by the wafer processing method of this embodiment will be described. figure 1 (A) is a perspective view schematically showing the front of the wafer 1, figure 1 (B) is a perspective view schematically showing the back surface of the wafer 1 .

[0038] The wafer 1 is, for example, a substantially disk-shaped substrate made of materials such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductors, or materials such as sapphire, glass, and quartz. Wait. The glass is, for example, alkali glass, non-alkali glass, soda lime glass, lead glass, borosilicate glass, quartz glass, or the like.

[0039]The front surface 1a of the wafer 1 is divided by a plurality of dividing lines 3 arranged in a grid. In addition, devices 5 such as ICs, LSIs, and LEDs are formed in each region demarcated by d...

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PUM

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Abstract

The invention provides a wafer processing method for forming a device chip without reducing quality. The wafer processing method divides a wafer, in which a plurality of devices are formed in each region of a front surface divided by division predetermined lines, into respective device chips. The wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an insideopening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying apressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to formshield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyolefin sheet side to push up each device chip through the polyolefin sheet and picking up each device chip from the polyolefin sheet.

Description

technical field [0001] The present invention relates to a wafer processing method, which divides a wafer with a plurality of devices formed in each area on the front side divided by a dividing line into individual device chips. Background technique [0002] In the manufacturing process of device chips used in electronic equipment such as mobile phones and personal computers, first, a plurality of intersecting dividing lines (streets) are set on the front surface of a wafer made of materials such as semiconductors. Then, devices such as IC (Integrated Circuit: Integrated Circuit), LSI (Large-Scale Integration Circuit: Large-Scale Integrated Circuit), and LED (Light Emitting Diode: Light Emitting Diode) are formed in each area divided by the planned division line. [0003] Then, an adhesive tape called a dicing tape, which is pasted on a ring-shaped frame with an opening so as to seal the opening, is pasted on the back or front of the wafer to form the wafer, the adhesive tape...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/67H01L21/683
CPCH01L21/67132H01L21/78H01L21/6836H01L2221/68336H01L2221/68386B23K26/53H01L21/67092H01L21/6838H01L21/67115C09J7/241B23K26/38C09J2203/326H01L2221/68381B23K26/40B23K26/364
Inventor 原田成规松泽稔木内逸人淀良彰荒川太朗上里昌充河村慧美子藤井祐介宫井俊辉大前卷子
Owner DISCO CORP