Polyurethane/ceramic powder heat-conducting insulating adhesive and preparation method thereof
A ceramic powder, thermal insulation technology, used in polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve problems affecting the processability of thermally conductive hot melt adhesives, limited practicability of thermal conductivity, and thermal conductivity. It can improve work efficiency and automation, fast curing, and improve thermal conductivity and insulation performance.
Inactive Publication Date: 2021-03-19
佛山市极威新材料有限公司
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Problems solved by technology
In recent years, some of the patented technologies of hot melt adhesives with thermal conductivity and insulation functions, and some of them are technologies developed around graphene, such as patents CN201310447910.X, CN201711151394.0, CN201711275263.3, etc. Thermal resistance has a great influence on thermal conductivity, and often cannot achieve the expected thermal conductivity value
Some researchers propose to use inorganic powders to improve thermal conductivity, such as common ceramic powders such as alumina and zirconia, such as patents such as CN201010239015.5, CN201310525198.0, CN201811476166.5, etc. The ceramic powders used in these patents The thermal conductivity of the body itself is very limited, and the shape is mostly spherical. From the perspective of thermal conductivity, its practicability is very limited. At the same time, the addition of a large number of fillers and the addition of some nano-scale fillers will greatly affect the processability of thermally conductive hot melt adhesives. sex
Method used
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Embodiment 1-5 and comparative example 1-7
[0062] Examples 1-5 and Comparative Examples 1-7: Preparation of Polyurethane / Ceramic Powder Thermal Conductive Insulation Adhesive
[0063] Weigh each component according to the formula content in Table 1, and mix all components except isocyanate evenly, then heat at 140-160°C for mechanical dispersion, and vacuumize to remove water for about 1-3 hours until the water content of the mixture The content is lower than 200ppm, lower the temperature at 70-100°C, under the protection of nitrogen, add isocyanate, carry out polymerization reaction for 1-10 hours, take samples and analyze the NCO% content of the polymerization product to reach 1%-3%, and test the viscosity at 100°C to reach 6000- 30,000 mPa.s to obtain polyurethane / ceramic powder heat-conducting and insulating adhesive; the performance indexes of the prepared polyurethane / ceramic powder heat-conducting and insulating adhesive are shown in Table 1.
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The invention discloses a polyurethane / ceramic powder heat-conducting insulating adhesive which comprises the following components in parts by weight: 9-29 parts of liquid polyester polyol; 31-61 parts of solid polyester polyol; 34-49 parts of polypropylene carbonate; 1.1-5.1 parts of tackifying resin; 6-26 parts of isocyanate; 0.01-3.1 parts of a catalyst; and 105-205 parts of a heat conduction filler. According to the invention, specific parts by weight of polypropylene carbonate is added into the formula of the polyurethane / ceramic powder heat-conducting insulating adhesive, and the form and distribution of the heat-conducting filler in the polyurethane / ceramic powder heat-conducting insulating adhesive product are adjusted by adding specific compound mass fraction ratio and specific types of conductive filler; and the heat-conducting insulating property of the obtained polyurethane / ceramic powder heat-conducting insulating adhesive is obviously improved, and the viscosity increasecaused by the nano-filler can be inhibited.
Description
technical field [0001] The invention belongs to the technical field of hot-melt adhesive preparation, and in particular relates to a polyurethane / ceramic powder heat-conducting insulating adhesive and a preparation method thereof. Background technique [0002] Hot-melt adhesives, also known as hot-melt adhesives, are solid at room temperature and will melt into a viscous liquid when heated to a certain temperature. After cooling to room temperature, it becomes solid again and has a strong bonding effect. Hot-melt adhesives have the advantages of fast bonding speed, non-toxicity, and simple bonding process, and are widely used in the fields of perfect book binding, packaging sealing, shoemaking, and textiles. With the development of the new energy industry, hot melt adhesives are also quietly deployed in the lithium battery industry. At present, they are mainly used for bonding between batteries. At this time, they need to meet certain thermal conductivity and high electrica...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C09J175/14C09J169/00C09J11/04C09J11/08
CPCC08L2205/03C09J11/04C09J11/08C09J175/14C08L69/00C08L93/04C08K7/18C08L57/02
Inventor 张耀根
Owner 佛山市极威新材料有限公司