A chip-scale package structure and manufacturing method for moisture-sensitive high color gamut backlight application

Abstract

The invention discloses a chip-level packaging structure for moisture-sensitive high-color-gamut backlight applications, which has a double-layer packaging structure: the inner layer is a fluorescent adhesive film containing KSF phosphor powder; the outer layer is a transparent adhesive film containing inorganic fillers; First, flip-chip the LED chip array on the substrate, and then vacuum-fit the five sides of the chip with a fluorescent adhesive film containing KSF phosphor powder, then cut the bottom adhesive film along the outer facade of the package, and then place the cut package in a secondary array. On the substrate, the outside of the package after cutting is vacuum-pressed and sealed with a silicone transparent film containing micron-scale inorganic fillers, and finally the CSP package is cut after curing. The invention has excellent moisture resistance, high hardness, heat conduction and light decay resistance, can be used for high-power LED devices, and improves the overall performance of the finished CSP packaging body.

Description

technical field [0001] The invention relates to the field of backlights, in particular to a chip-level packaging structure and a manufacturing method for moisture-sensitive high-color-gamut backlight applications. Background technique [0002] With the maturity of flip-chip LED chip CSP (Chip Scale Package) manufacturing technology, TFT-LCD (Thin Film Transistor Liquid Crystal Display) using CSP (Chip Scale Package) white LEDs as backlight components has gradually become the mainstream. In order to pursue high color gamut To display the effect, the LED phosphor uses a combination of KSF fluoride phosphor and β-SiAlON phosphor with a narrow half-peak width. KSF phosphors will deteriorate due to chemical reactions when exposed to water. Although phosphor manufacturers have carried out phosphor surface passivation treatment, for long-term reliability requirements, simple surface treatment of KSF phosphors cannot prevent the entry of water vapor, that is, The purpose of protect...

AI Technical Summary

Problems solved by technology

[0003] Backlight applications usually use medium and high-power LED CSPs. When the blue light emitted by the chips excites phosphors, a large amount of heat is released, and the thermal conductivity of silica gel is poor. The problem of glue cracking leads to failure or changes in color coordinates, so it is necessary to solve the heat dissipation problem of the package

The hardness of silica gel is relatively low, the surface of the package is easy to scratch, and the performance of the sorting machine is not good, so it is necessary to increase the hardness of the package

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