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Sn-Bi-Cu-Ag-Ni-Sb low temperature lead-free solder alloy with high mechanical property

A sn-bi-cu-ag-ni-sb, lead-free solder alloy technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problem of reduction, achieve a high degree of alloying, Uniform refinement of solder crystal structure and improvement of mechanical properties

Inactive Publication Date: 2021-04-13
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the problem of low-temperature lead-free solder in the prior art, a kind of SnBiCuAgNiSb low-temperature high-mechanical performance lead-free solder alloy is provided. The invention utilizes the phase diagram to select the temperature range of 180-210°C, and calculates the solidification process through Thermo-Calc software (See figure 1 ), determine the precipitation of each phase, determine the composition point of Sn-Bi-Cu solder, then add trace metal element Ag, and then add trace metal element Ni for compounding. The results show that the melting point of the solder alloy after compounding is 176-205°C , the structure is obviously refined under the action of Ag and Ni, and the enrichment of Bi is suppressed, which greatly improves the mechanical properties and reliability of the solder, and reduces the melting point of the Sn-Ag-Cu series lead-free solder (compared to the Sn-Ag-Cu series lead-free solder -Ag-Cu series), adding Sb to increase strength, the developed solder alloy has excellent comprehensive performance, low cost and high applicability

Method used

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  • Sn-Bi-Cu-Ag-Ni-Sb low temperature lead-free solder alloy with high mechanical property
  • Sn-Bi-Cu-Ag-Ni-Sb low temperature lead-free solder alloy with high mechanical property
  • Sn-Bi-Cu-Ag-Ni-Sb low temperature lead-free solder alloy with high mechanical property

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Effect test

Embodiment 1

[0019] Embodiment 1: A kind of Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with high mechanical properties at low temperature, in terms of mass percentage, the lead-free solder alloy comprises: Bi14%, Cu 0.5%, Ag0.6%, Ni 0.04%, Sb 0.004%, the balance of Sn and unavoidable impurities; in the preparation process of Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with low temperature and high mechanical properties, Ag, Cu and Ni are respectively used as master alloy sn 3 Ag, Sn 10 Cu, Sn 4 Ni is added in form, Sb is added as pure substance, and insufficient Sn is added as pure Sn;

[0020] The metallographic structure diagram of the cross-section of the solder joint of the Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with low temperature and high mechanical properties in this embodiment is as follows figure 1 shown, from figure 2 It can be seen that the structure of the solder alloy matrix is ​​uniform, the grains are refined, the wetting angle is small, and the wettability is good.

[0...

Embodiment 2

[0022] Embodiment 2: A kind of Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with high mechanical properties at low temperature, in terms of mass percentage, the lead-free solder alloy includes: Bi14%, Cu 0.5%, Ag0.6%, Ni 0.03%, Sb 0.01%, the balance of Sn and unavoidable impurities; during the preparation process of Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with low temperature and high mechanical properties, Ag, Cu and Ni are respectively used as intermediate alloys sn 3 Ag, Sn 10 Cu, Sn 4 Ni is added in form, Sb is added as pure substance, and insufficient Sn is added as pure Sn;

[0023] The solder alloy electronic scanning diagram of the present embodiment Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical performance lead-free solder alloy is shown in image 3 shown, from image 3 It can be seen that Ag 3 Sn is uniformly distributed and distributed in orientation, and branched crystals strengthen the stability of solder;

[0024] The metallographic structure diagram of th...

Embodiment 3

[0026] Embodiment 3: A kind of Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with low temperature and high mechanical properties, in terms of mass percentage, the lead-free solder alloy includes: Bi14%, Cu 0.6%, Ag0.6%, Ni 0.05%, Sb 0.04%, the balance of Sn and unavoidable impurities; in the preparation process of Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with low temperature and high mechanical properties, Ag, Cu and Ni are respectively used as intermediate alloys sn 3 Ag, Sn 10 Cu, Sn 4 Ni is added in form, Sb is added as pure substance, and insufficient Sn is added as pure Sn;

[0027] The performance test data of the Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with low temperature and high mechanical properties in this example is shown in Table 1. The melting point of the lead-free solder is 197.23°C, the melting range is 17.34°C, and the tensile strength is 98.34Mpa , yield strength 87.23Mpa, elongation 22.14%, wetting time 0.37s, maximum wetting force 0.93mN, density 8.29g / cm ...

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Abstract

The invention discloses a Sn-Bi-Cu-Ag-Ni-Sb low temperature lead-free solder alloy with a high mechanical property and belongs to the technical field of electronic welding. The lead-free solder alloy comprises 14-18% of Bi, 0.4-0.6% of Cu, 0.5-0.8% of Ag, 0.03-0.07% of Ni, 0.001-0.2% of Sb and the balance of Sn and inevitable impurities. In a preparation process of the Sn-Bi-Cu-Ag-Ni-Sb low temperature lead-free solder alloy with the high mechanical property, Cu, Ag, Ni and Sb are added in form of intermediate alloys. The alloy has good lubricating performance at a low temperature and the mechanical property is superior to that of Sn-Ag-Cu lead-free solder. As the percent by pass of Ag is reduced, the production cost of the lead-free solder alloy is lowered greatly and the smelting point ranges from 176 to 205 DEG C.

Description

technical field [0001] The invention relates to a Sn-Bi-Cu-Ag-Ni-Sb lead-free solder alloy with low temperature and high mechanical properties, which belongs to the technical field of electronic welding. Background technique [0002] Sn-Pb solder is the "glue" in electronic packaging technology. Sn-37Pb can provide physical connection and also realize the signal transmission function between electronic components. Due to the abundant reserves of Pb, low price, good electrical conductivity, good brazing performance, and low melting point (about 183°C), the size of components will not change too much during welding, making it widely used. With the advancement of electronic packaging materials and technology, and the increasing demand for portability and multi-functionality of electronic products, miniaturization and light weight have been paid more and more attention by everyone. With the rapid development of large-scale integrated circuit technology, semiconductor components ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 严继康陇赞陈东东滕媛顾鑫徐凤仙甘国友易健宏刘明陈俊宇梁东成祖梓翀
Owner KUNMING UNIV OF SCI & TECH
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