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Copper-based amorphous sheet material for brazing and preparation method thereof

A sheet material, brazing technology, applied in the direction of welding/cutting medium/material, welding equipment, welding medium, etc., can solve the problem of inability to accurately control the width and thickness of the strip, unable to meet the application requirements, and large size deviation of the amorphous strip To achieve the effect of simple and controllable production process, improve welding wetting performance, and ensure molding stability

Active Publication Date: 2021-04-30
研迈电子材料(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention patent adopts the method of evenly distributing the amorphous alloy solution of the spray belt on the cooling roller, cooling the alloy solution to form a non-wafer, but this traditional cooling roller cannot accurately control the width and thickness of the strip, resulting in the size deviation of the amorphous strip Large, low quality, unable to meet application requirements

Method used

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  • Copper-based amorphous sheet material for brazing and preparation method thereof
  • Copper-based amorphous sheet material for brazing and preparation method thereof
  • Copper-based amorphous sheet material for brazing and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0039] see figure 1 , a copper-based non-wafer material for brazing, the material components of the copper-based non-wafer are mainly metal copper, phosphorus, metal tin, metal nickel, metal titanium, metal indium, wherein the copper content is: 86.35 wt%, the phosphorus content is 5 wt%, the tin content is 7.5 wt%, the nickel content is 1 wt%, and the cobalt content is 0.15 wt%.

[0040] The steps of the preparation method include:

[0041] The first step is to weigh 43.175Kg of electrolytic copper plate, 2.5Kg of phosphorus, and 3.75Kg of tin block respectively.

[0042] In the second step, the material in the first step is added to the suspension melting furnace, and vacuum melting is carried out. The melting temperature is 1280° C., and the temperature is kept for 30 minutes to obtain a copper-phosphorus-tin master alloy.

[0043] The 3rd step, respectively weigh 0.5Kg nickel sheet, 75g cobalt, mix with the copper-phosphorus-tin mother compound in the above-mentioned sec...

Embodiment 2

[0049] The main difference from Example 1 is that in this example, the trace element added is titanium, and the copper-based non-wafer has a thickness of 0.04 mm and a width of 5 mm.

[0050] The material components of the copper-based non-wafer are mainly metallic copper, phosphorus, metallic tin, metallic nickel, metallic titanium, and metallic indium, wherein the copper content is 86.35 wt%, the phosphorus content is 5 wt%, the tin content is 7.5 wt%, and the nickel content is 1 wt%, titanium content is 0.15 wt%.

[0051] like figure 1 , the preparation method of the copper-based non-wafer material of the present embodiment, the operation steps are as follows:

[0052] Step 1: Weigh 43.175Kg electrolytic copper plate, 2.5Kg phosphorus, and 3.75Kg tin block respectively.

[0053] The second step: adding the above-mentioned materials in the first step into the suspension melting furnace, and carrying out vacuum melting at a melting temperature of 1300° C., holding the tempe...

Embodiment 3

[0059] The main difference from Example 2 is that in this example, the trace addition elements are titanium and indium, and the copper-based non-wafer has a thickness of 0.05 mm and a width of 20 mm.

[0060] In the preparation of the copper-based non-wafer material in this example, the material components of the copper-based non-wafer are mainly metal copper, phosphorus, metal tin, metal nickel, metal titanium, and metal indium, wherein the copper content is 86.3wt%, and the phosphorus content is 5wt%. , the tin content is 7.5 wt%, the nickel content is 1 wt%, the titanium content is 0.1 wt%, and the indium content is 0.1 wt%.

[0061] The preparation method steps include:

[0062] Step 1: Weigh 43.15Kg of high-purity copper powder, 2.5Kg of phosphorus, and 3.75Kg of tin block respectively.

[0063] The second step: adding the above-mentioned materials in the first step into a suspension melting furnace, and performing vacuum melting at a melting temperature of 1280° C., kee...

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Abstract

The invention discloses a preparation method of a copper-based amorphous sheet material for brazing. The preparation method comprises the following steps: 1, weighing a certain amount of oxygen-free copper, phosphorus and high-purity tin blocks; 2, carrying out suspension smelting on the material obtained in the step 1 to obtain a copper-phosphorus-tin master alloy block; 3, weighing a certain amount of high-purity nickel sheets and trace elements, mixing the high-purity nickel sheets and the trace elements with the copper-phosphorus-tin master alloy block obtained in the step 2, and then carrying out suspension smelting to obtain a copper-phosphorus-tin-nickel melt; 4, injecting the melt in the third step into a high-pressure storage cavity; 5, starting a nozzle device to spray out the melt in the fourth step and enabling the melt to enter a rapid cooling forming die cavity to obtain the copper-phosphorus-tin-nickel amorphous material; and 6, pulling and winding the material into a disc to obtain the copper-phosphorus-tin-nickel amorphous strip. The preparation process is completely different from a traditional production process, the size of the strip can be conveniently controlled, a real thin strip is obtained, and the production process is simple and controllable; and the process has obvious advantages and effects, and can better meet the requirements of different applications.

Description

technical field [0001] The invention relates to the technical field of metal alloy materials and preparation thereof, in particular to a copper-based non-wafer-shaped material for brazing and a preparation method thereof. Background technique [0002] Copper-based solder tab is one of the most widely used brazing materials, with the advantages of low cost and high welding strength. The main components of copper-based solder tabs are copper-phosphorus, copper-phosphorus-tin, silver-copper-phosphorus, etc., which are mostly prepared by smelting and rolling processes. In order to obtain thinner and narrower solder tab products, the industry continues to upgrade equipment and purchase imported high-precision rolling mills. , hoping to roll the welding sheet thinner to meet the ever-escalating industrial demands. At present, the thinnest size of copper-based solder tabs is 0.08mm. If rolling is continued, the solder tabs will crack due to the brittleness of the solder compositio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/30
CPCB23K35/40B23K35/302
Inventor 王鹏鹏沈敏华
Owner 研迈电子材料(上海)有限公司
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